
Ong Li Jia
Product Development Engineer @ Intel
Malaysia
Penang
Semiconductors
Semiconductors, SoC, Testing, JMP, Perl, Electronics, Microsoft Excel, Microsoft Word, PowerPoint
Experience

Product Development Engineer
• Test Program Engineer for Valleyview (VLV) product. Developed test program using CMTP software to create test contents modules which to be validated on CMT and HDMT testers. Responsible in delivering optimized test program to Intel’s SOC product by ensuring the test contents working with design, meeting the test quality and the test time. Worked with test time reduction team in optimizing the test time of test program to ensure the test time of each package is short and therefore increase the productivity in manufacturing floor. Developed a test program with test time reduction of 31% which meets the manufacturing PHI. Involved in the analysis in yield sightings and drive the yield resolutions to improve yield of the product. • Open/Short test owner for VLV. Developed test content for open and short testing to screen the assembly defects, silicon defects or tester setup problem that caused the continuity problems between the tester and the DUT. Performed kill limit characterization based on 6 sigma method for open/short test to screen the die package by ensuring no escapee occurred. Worked with Failure Analysis team to analyze the root causes and failure modes to prevent reoccurrence of same nature. • Developed Manufacturing Validation test for Leakage and VIXVOX tests across various IO, such as DDR, GBE, CFIO, MODPHY, USB etc to ensure the content is within the electrical specifications of leakage current and impedance. Worked with content owner to deliver the outcome of the MV activity to increase the confidence level of the content developed though the MV data. • Involved in data analysis for DC test such as VCC Continuity, Open/Short, EDM, Leakage and DC VOX tests in the Cedarview project. Delivered kill limit for pre-ITAC HDMT TP release to ensure the limit is robust and covering most of the wafer lot. Developed skill on JMP statistical software tools when performing the data analysis for the above tests.

Test Engineer (Internship)
• Involved in the PCB board testing on Takaya tester and fine tune the failed components through the program. Highly involved in the tester operations such as function such as alignment of four point probes with the camera system, machine setting adjustment of the four point probes in accordance to the machine reference point. • Carried out the improvement project on the Takaya by optimizing the program using two probes to four probes to speed up the test checking process.
Ong Li Jia's Contact Information
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