Maura R.

Led distributed team of SW developers in 4 time zones to design and implement solution to speed up AI hardware delivery. Created architecture spanning Google and factory sites, and prototype UI. Spearheaded design of scalable security solution for factory floor servers, and led program to reduce HW/SW risks in DCs, as TL. Enabled optical circuit switch functionality via side project, leveraging optics experience. Primary technical representative for X-functional teams across Google.

Drove new testing standards as manager/supervisor of 8 test SW developers. Owned conversion of 200K-line software repository from python 2 to 3. Python 3 repo deployment was downtime-free, and remained stable post-bringup. Developed and optimized test stations, troubleshooting issues such as parallel resource use by network switches. Launched project to pull additional data to factory floor to reduce escapes and manual errors.

Technical lead for DC optics reliability, quality, manufacturing. Managed work of 2 Ph.D.s and 1 data engineer. Executed reliability qualifications and validation of >30 component types with diverse failure modes. Developed complex Python/MATLAB/JMP/SQL scripts to test components, analyze performance, troubleshoot product line health, and uncover issues. Directed or performed experiments, station debug, and failure analysis. In Fiber: built, debugged, improved SW on R&D optical system test stations. Drove next-gen design improvements. * Experiments/analysis lead to design/process/spec changes, or disqualifications, with optical circuit switch, transceivers, fiber arrays, lasers, thin film & metal coatings, MEMS, hermetic packages, PCBs, epoxies, solders, photodiodes, photonic ICs * Created robust >20B row database on weekends that was completely outside job scope * Technical program sub-committee chair and/or member for 3 years at OFC

Optical components engineer since 10/2011. Quality owner for active and passive optical components in Infinera systems, including vendor audits and reliability troubleshooting. Photonic integrated circuit (PIC) product engineer 8/2008~10/2011. Supported current and next-generation product design, epitaxy, fabrication, and testing. Troubleshot yield issues with epitaxy, fab tool, mask, and test changes. Final reviewer of product quality/ship-ability. Automated complex manual product disposition (pass/fail) system. Owned department change control meeting. Final year focused on reliability testing and analysis of next-generation devices. PIC development engineer 2/2006~8/2008. Assembled lab equipment for test stations, and developed automated test software, for DC characterization of next-gen PICs. Optimized passive optical components through simulations and test data analysis. Designed new epitaxial structure that enabled improved next-generation device performance. Brought new metrology tool up for production, including repeatability troubleshooting, GR&R, and training.

Developed DBR multi-mode interference bistable laser all-optical flip-flops, including device design, mode evolution/gain simulations, MOCVD growth/regrowth, fabrication, and measurement. Wrote gratings with e-beam writer. Re-introduced this DBR grating fabrication and active/passive integration regrowth process to this lab.

John Bowers research group Thesis title: "Three-dimensional Wafer-Bonded Photonic Waveguide Devices"