Lee Fueng Yap

SoC Design Engineer @ Intel

About

Striving for a career that bring positivity and new knowledge to the industry Specialties: Metastability bug prevention CDC and RDC verification eTRON (smart-card technology, embedded system) Ubiquitous computing, ecommerce, location-based services Mobile Forensics, Internet Forensics Computer and Mobile Devices Forensics, Network Protocols, Network Security - IPSEC, AAA, PKI, IDS/IPS, Intel IXP Network Processors, C++, Microcode. Holding patent in network communication for BT

Country

Malaysia

City

Penang

Industry

Computer & Network Security

Skill

Clock Domain Crossing, Metastability, Market Research, Mobile Devices, E-commerce, Product Development, Design Research, Online Research, Data Analysis, Security, Embedded Systems, Ubiquitous Computing, Smart Cards, Data Privacy, Computer Program, Reset Domain Crossing

Experience

SoC Design Engineer

Intel

2012-7 - Present · 14 yrs 3 mos

Penang

PhD Graduate

The University of Tokyo

2008-4 - 2012-3 · 4 yrs

Tokyo, Japan

Graduated with Highest Honors eTRON, Security and Privacy in Ubiquitous Computing

Researcher

BT Group

2006 - 2008 · 2 yrs

• Main area of research was in mobile forensic and network forensic. • Researched on PKI potential in addressing mobile security issues with regards to networks convergence process. • Researched on finding new application usage model utilizing existing data communication technologies.

Technical Marketing Engineer

Intel

2004 - 2006 · 2 yrs

• Appointed as SDK Product Development Team Technical Marketing Engineer. Responsibilities include planning of SDK release and features definition. Acted as the single point of contact for marketing group for worldwide customers feedback on SDK related issues. • Acted as the customer support engineer for India, PRC, Taiwan and Australia. • Appointed as Intel IXP-C compiler primary support engineer for Technical Marketing Group, primary/single contact for all customer support related to IXP-C related issues.