KUN CHEN PENG

Technical Program Manager @ 智邦科技股份有限公司

About

Senior Technical Program Manager with 14+ years of experience leading complex hardware development and infrastructure programs in the data center and power electronics industries. Experienced in driving cross-functional execution across engineering, manufacturing, supply chain, and external partners to deliver large-scale systems from concept through mass production. My work has focused on hyperscale infrastructure and advanced computing platforms, including AI server, networking, and rack-level power architecture. I specialize in system-level program leadership — translating evolving customer requirements and technical constraints into structured development plans that align engineering teams, manufacturing operations, and global supply chains. Known for navigating ambiguous environments and integrating diverse technical domains such as system architecture, power delivery, and platform integration to keep complex programs moving forward. Experienced working directly with global customers and multicultural teams, using English as the primary working language. Particularly interested in AI data center infrastructure, system integration, and large-scale platform programs where networking, compute, power, and cooling architectures converge. Areas of interest: AI Datacenter Infrastructure, Rack Architecture, Hyperscale Systems Integration.

Country

Taiwan

City

New Taipei City

Industry

Electrical & Electronic Manufacturing

Skill

Engineering Program Management, Stakeholder Management, Programme Governance, Risk Management, New Product Introduction (NPI), Power Systems, Networking Systems, Hardware Program Management, Technical Program Management, Data Center Infrastructure, System Integration, AI Server Platforms, Rack Architecture, Marketing Strategy, Product Marketing, Market Research, Market Analysis, Product Management, Program Management, Cross-functional Team Leadership

Experience

Technical Program Manager

智邦科技股份有限公司

2025-2 - Present · 1 yr 8 mos

台灣臺中市

• Lead cross-functional teams (HW, SI, ME, Thermal, SW, and Manufacturing) to execute advanced data center switch programs for leading CSP customers. • Drive early-stage NPI and ensure alignment with aggressive PRD schedules, milestone gates, and manufacturing readiness. • Coordinate with global stakeholders—including ASIC vendors, optics suppliers, and thermal partners—to manage risk mitigation, schedule pull-ins, and technical trade-offs. • Integrate data center power architecture considerations into platform-level design to support high-density AI/compute infrastructure. • Oversee EVT/DVT/PVT builds and conduct technical assessments for high-speed interconnect and thermal solutions. • Facilitate program governance, enabling efficient decision-making and maintaining execution momentum across engineering teams.

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Acbel Polytech Inc.

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