靖宇 王
製程整合工程師 @ United Microelectronics Corporation (UMC)
About
Process Integration Engineer with 5 years of work experience.4.5 years at TSMC focusing on 3nm/6nm/7nm Logic device manufacture, familiar with NTO product process /WAT analysis/ yield improvement.Currently working at UMC Singapore for ~7 months, handling 28nm SION platform setup.
Taiwan
Kaohsiung Metropolitan Area
Semiconductors
Microsoft Excel, Microsoft PowerPoint, Microsoft Word, FinFET, Data Analysis, JMP
Experience
製程整合工程師
United Microelectronics Corporation (UMC)
新加坡
UMC Singapore NXP 28SION product team(2025.08~today): •Transfer NXP SION28 platform from Taiwan to Singapore: NTO pirun and inline matching •SION28 Alpad black dot issue improved: OQA Bad Die ratio 20% to 0% •Wafer edge MBIST low yield root cause finding
製程整合工程師
TSMC
台灣 臺南市 安定區
F15B N6/N7 (2020.09~2023.04): •4 NTO product handle experience, achieved device goal and delivered on time •~10% yield improved on the responsible product. •Low yield root cause finding. F15A N22/N28 (2023.04~2023.07, 3 months support): •Renesas 28nm NVM MONOS specialty product daily management F18B N3 (2023.07~2025.02): •BEOL M0~M5 process improvement: SWLY Baking CIP/Via under etch CIP/ CMP U% CIP •N3C cost reduction project: M4M5 process optimization, total cost -0.5% •N3E/P Mining machine NTO handle
Education
National Cheng Kung University
微電子研究所
Major: semiconductor manufacture, semiconductor physics, memory device Master's thesis: Fabrication of CuInSe2 Schottky diode and β-Ga2O3 Schottky diode
National Sun Yat-sen University
電機工程學系
Major: semiconductor physics, C++ program
靖宇 王's Contact Information
Phone
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