Kar Leong Lee

RFFC Assembly Die Attach Equipment Engineer @ NXP Semiconductors

About

I have graduated with a Bachelor of Electrical and Electronic of Engineering with Honours from University Malaysia Sabah, Malaysia in 2020. To fully equip myself with the fundamental knowledge and skills in this field, I took several engineering courses, such as Engineering Thermodynamics, Analog Electronics and Applied Mechanics. I obtained an A grade for all these courses. I had my internship in Dong Hai Hole Saw Co., South Korea. During my internship, I assisted in manufacturing various types of holesaw as well as in checking the quality of the produced holesaw before packaging process. Besides, I also learned to operate and troubleshoot the industrial graded machines. I believe I have the knowledge and skills needed to be in this field I participated in extra-curricular activities during my campus life, which has strengthened my communication and interpersonal skills. In addition to these skills, I also possess leadership qualities and a passion for work in this field. I am a flexible person and able to work under pressure.

Country

Malaysia

City

Seremban

Industry

Semiconductors

Skill

Engineering, C (Programming Language), Microsoft Office, MATLAB, AutoCAD, Verilog, PSpice, Customer Service, Team Leadership, CST Microwave Studio, Proteus, Gym, First Aid, Arduino, Manufacturing, Programming, Analytical Skills, Problem Solving

Experience

RFFC Assembly Die Attach Equipment Engineer

NXP Semiconductors

2025-4 - Present · 1 yr 6 mos

Petaling Jaya, Selangor, Malaysia

1. Equipment Engineering & Maintenance Responsible for sustaining and optimizing RFFC assembly die attach equipment, with hands-on expertise in ESEC and Datacon Quantum platforms to ensure stable production performance and high equipment uptime. 2. Semiconductor Packaging & Product Knowledge Strong technical knowledge in semiconductor packages and materials including RF devices, Gallium Nitride (GaN) die, and Flip‑Chip Ball Grid Array (FCBGA) technologies. 3. New Technology & Line Setup Actively involved in the setup and qualification of the Flip Chip Chip Scale Package production line at NXP Semiconductors ATKL, supporting new technology introduction and manufacturing readiness.

RF Assembly Department Cost Controller

NXP Semiconductors

2023-3 - Present · 3 yrs 7 mos

Petaling Jaya, Selangor, Malaysia

Manufacturing Cost Control & Strategy Acting as RF assembly cost controller, responsible for monitoring and optimizing assembly costing. Key contributor to ATKL plant-wide cost-saving initiatives, supporting strategic cost reduction and operational efficiency programs.