Junfeng Wu

Currently I am Intel's 3D NAND flash product lead. My job role is mainly to ensure flash memory TLC functional and meet device qualification requirements for Intel's client and enterprise SSD and other system customers. My work includes NAND array/process characterization, reliability, device operation algorithms, performance optimizations, failure analysis, HVM manufacturing and product qualification. I have over 10 years industrial experience in semiconductor field, especially in flash memory product development, testing, new process characterization and failure analysis. I am also familiar with C/C++, python and perl programming/script language. I started on the advanced silicon technology development since my training days in college. After joining Intel, I have worked on the research and development of each generation of MLC/TLC NAND flash memory technology from planar NAND to 3D NAND. I am an effective communicator with strong interpersonal and negotiation skills. Specialties - Semiconductor Device Physics, - Semiconductor HVM Manufacturing, - NAND flash RWB development(Read Window Budget) and Product characterization, - Software Development : C/C++, Perl, Python, - Test flow methodologies development, - Statistical and yield analysis. - Project planning and management.