Jun 俊 Yang 杨
TD Senior Director 资深总监 @ University of Utah
About
30 years hands-on experience, roles and responsibilities of various levels in semiconductor IC manufacturing, module process, R&D, and capital equipment at industry-leading, volume production companies including the two biggest foundries in China. Deep vision of IC technology developing trend, both technical and business shrewdness, great communication and team management skills, and extensive connections in US and China semiconductor industry.
China
Guangzhou
Semiconductors
Electrical Engineering, Microelectronics, Semiconductors, JMP, CMOS, IC, Failure Analysis, Electronics, Design of Experiments, SPC, Silicon, Manufacturing, VLSI, Six Sigma, CMP, Metrology, CVD, Thin Films, Semiconductor Industry, Customer Service
Experience
TD Senior Director 资深总监
Ascenpower Semiconfuctor 广东芯粤能半导体
Guangzhou(Canton), China
TD Module/PIE、SiC power device
Senior Director TD Module 资深处长
芯恩（青岛）集成电路有限公司 SiEn (QingDao) Integrated Circuits Co., Ltd.
Qingdao，China
Partner 合伙人
Neowing Capital 凌越资本
Shanghai，China
PE/VC.
Deputy Director & TD CMP&WET Department Manager 部门总监
SMIC
Pudong，Shanghai，China
SMIC is the biggest and most advanced foundry in China. Led a talented team of 40+, worked on 28/14nm logic process development
Sr. CMP Manufacturing Engineer
HGST, a Western Digital brand
San Jose, CA
CMP Application Engineer
Ebara Technologies
IBM, East Fishkill, NY/IMFT, Lehi, UT
Principal Process Engineer Wet Etching/Cleaning and CMP
上海华虹NEC Hua Hong NEC
Shanghai, China
HHNEC was the first 200mm wafer fab ever built in China.
Process Engineer Wet Etching/Cleaning and CMP
上海华虹微电子 Shanghai Hua Hong Microelectronics
Shanghai, China
Education
University of Utah
Electrical Engineering
Rochester Institute of Technology
Microelectronics Engineering
Shanghai Jiao Tong University
Electronics Engineering (Microelectronics)
Jun 俊 Yang 杨's Contact Information
Phone
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