Jiang Zhao

* Track the development of new product projects, and be responsible for the systematic creation of new product specifications, data collection, and preparation of engineering documents. * Collaborate with the quality control department and external quality system audits, such as automotive semiconductor products, AEC-Q100, IATF-16949, A-SPICE, JEDEC-47, ISO-26262... * Write and deliver product datasheets and appnotes to external customers; communicate with customers about new project NAND features/design bugs. * Plan 3D NAND Flash product reliability verification according to JEDEC and customer requirements; * Propose optimization solutions for important work windows and technical limitations of the product. * Lead and coordinate the development and execution of solutions for product defects/issues

* External interface for the 3D NAND Flash technology department; collaborating with marketing, systems, firmware, reliability, and other departments to manage project execution. * Responsible for developing key milestones and timelines for the product development PLC (product life cycle). * Assisting and supervising various R&D departments to deliver product verification reports on schedule. * Issuing product requirements to various NAND Flash technology departments (design, verification, devices, reliability, memory health). * Writing and verifying test scripts

Development of 24nm NAND Flash process; WAT/Yield testing; owner for layout design rule check; NAND failure analysis

0.13um Embedded NOR Flash product owner, external customer interface, maintaining product yield; leading internal departments to complete customer 8D reports

Development on 40/28nm Logic and 90nm NOR Flash process technologies

Yield improvement through EFA and PFA

Hynix Fab 300mm Wafer 55nm DRAM Process inline metrology Support