Jagmeet Singh Bhullar

Maintain the Lean principles, including 5S, Kaizen, and value stream mapping, to improve manufacturing processes and reduce waste. •Perform Functional test using various software like Linux(CLI), JTAG, GNUradio, JFrog Clouding and related. •Perform assembly of printed circuit boards (PCBs), including soldering and troubleshooting techniques. •Perform RCA on defects and implementing corrective actions to improve production processes. •Read PCB Drawing and Schematics and collaborate with team to make changes in it. •Generate Non-Conformance Reports & provide solutions.

Perform functional Test of Printed Circuit Board Assemblies. •Assemble the Soldered Boards with necessary tools. •Operate Automated Optical Inspection Machine. •Soldering of through hole connectors, Single In-Line, Dual In-Line and SMT. •Operated and maintained electronic assembly equipment, including stencil printers, pick-and-place machines, and reflow ovens. •Inspect and Solder of 0603 and Larger chips components and Metal Electrodes Leadless Faces. •Rework and Repair using Hot Air Reflow and other De-soldering tools. •Troubleshoot the Printed Circuit Board with the help of Specifics tools and by visual inspection.

Assemble and test Teledyne DALSA products that meet or exceed the quality expectations by following blueprints and work instructions. •Performs various types of soldering including surface mount, thru-hole, and hand-soldering. •Performs floor audit, record data and report the result. •Follow material control procedures to maintain accurate inventory records. Identify discrepancies and report them. •Follow material handling procedures to ensure the safe handling of susceptible components or assemblies. •Follow problem and defect reporting procedures and notify the appropriate associate responsible for action. •Performed incoming process and final inspection in support of quality assurance. •Support continuous improvement opportunities and their implementation.