IRis Lim, PMP

• Develop and implement project roadmaps and milestones. • Implement end to end project life cycle. ● Develop, build and maintain strong relationships both internaly and externaly in order to achieve project objectives. ● Perform project tracking through clear & concise status reports. • Track project member progress against commitment. ● Coordinate and plan resource calendar on every project milestone. ● Colect project requirements and prepare acceptance documents. ● Conduct UAT with client before project live. ● Liaise with vendors on system integration and conduct SIT.

• Oversee customers's software development projects • Manage stakeholder engagement • Planning & assign resources availability and allocations • Manage customer relationships & issues • Software enhancement testing • Develop project management system

1) Customer technical support. 2) Technology planning and process control. 3) Implement new wafer technology. 4) Wafer supplier qualification and develop wafer technology roadmap. 5) New production introduction (NPI) team in planning, execution and product launch.

-Lead and implement new wafer technology project. -Tracking wafer supplier performance. -Qualify wafer supplier by performing continuos test which achieve quality and technical target. -Achieve & allign material R&D roadmap. - Support troubleshoot, problem solving and provide innovation ideas for improving. -Conduct supplier audit yearly. - Support internal ISO audit yearly.

-Develop wafer R&D improvement with supplier. -Tracking wafer supplier performance. -Qualify wafer performance from it's improvement. -Achieve & allign material R&D roadmap.

Conduct SOP & make sure procedure compliance. Analysis & create FMEA, Risk & Opportunity in production. Analysis & interpret data on improvement project. Conduct improvement project such as cost saving, improved quality and increase manpower efficiency.

- Expand on marketing of business. - Keep track with customer on their demand and fullfill their statification. -prepare quotation, analyze cost and liaise with all parties in term of techinical and schedule.

-Studied fundamental semiconductor properties and structure. Understand physical and chemical changes in semiconductor with applied temperature, doping and etc. - Studied material characteristics whether on metal, non metal, alloy, plastic and glass. - Understand material structure and physical affect.