Hung-Yu (Henry) Lin

◼︎ Lead high-level reliability verification for MMIC and Mixer chips in defense satellites. • Communicated requirements with international clients, evaluated, built, and automated a new reliability measurement system. ◼︎ Lead uLED reliability test from P1, DVT, EVT, to MP. • Communicated requirements with international clients, evaluated, and established environmental reliability and measurement systems (non-op/op HS, DHC, TC, ESD). ◼︎ Development of moisture reliability for VCSELs. • Reviewed literature and established failure mechanisms for all reliability test items of VCSEL. • Familiar with failure analysis (IV, OBIRCH, EMMI, CP, FIB, SEM, TEM, X-Ray, SAT, EDS) and lead the FA team's analysis. • Lead SQE team in outsourced audits and DOE experiments to find the root causes of reliability failures.

◼︎ Perform R&D and MP reliability sampling tests for pHEMT and HBT MMIC. • Executed HTOL, MTTF, THB, (b)HAST, TC, op/non-op HS, EM, ESD, TDDB… and report generation. • Experience in outsourcing reliability test and communication with three major testing companies. ◼︎ Managed High-Reliability project for Commercial Satellite. • Executed board level Burn-in & HTOL test, packaging adhesion verification. • Board-level semi-automatic probe stations, source measurement units, and network analyzers setup, integration and automation. • Customization and improvement of package boards, S-parameter measurement, scheduling of equipment operation personnel, and test report generation. • Self-study Excel-VBA for generating automatically reliability test plans and reports. Reduced document processing time by 80% and reduced the risk of human error. ◼︎ Reliability verification of photodiode in development phase. • Pico-level CVIV test system setup and meet the daily capacity requirement of 1800ea/day, and pass customer-specified verification, including MSA, Gage R&R, Tool Matching, SPC, etc. ◼︎ Development and improvement of testing and measurement systems in lab. • Develop auto in-situ HTOL/MTTF test system. • Develop SMU-based source and monitor system for bHAST. • Solve the issue that the actual Tj is too high during HTOL/MTTF to avoid underestimating the lifetime. • Find and resolve the root cause of inaccurate MTTF testing that has suffer the department for years. • Paper study on heat conduction/thermal expansion/stress/water absorption/contaminations/ECM/leakage of package, and upgrade the reliability test carrier • Self-learning Ansys and related literatures such as heat source position/junction temperature (Tj)/electromigration (EM) of each product, and build the method of Ansys simulation. • Learn layout PCB software (Altium Designer) and PCBA outsourcing for future products.

• Leading the reliability evaluation and selection of new VCSELs • Development of burn-in process for 2x100G fiber optical transceiver NPI.