Hung-Chih Li

Technical Program/ Project Manager @ Applied Materials

About

Core Value Proposition1. Technical Sales Enablement: Proven track record of supporting team-wideachievements that secured $4B+ USD in revenue by translating technical mastery intocommercial value.2. Market Strategy & Validation: Skilled in conducting competitor analysis and providingtechnical validation for product positioning and Cost-of-Ownership (CoO)optimization.3. Contract Optimization: Expert at managing service contracts (PMSA/MSA) to optimizeresources, meet technical KPIs, and improve profit margins.4. Global Technical Leadership: Experienced in managing cross-functional teams anddeployment projects across Taiwan, Japan, Korea, Singapore, and China.Achievement Summary:1. Success on introducing ASM advanced technology into tsmc and UMC and qualify mass-production.2. Support ASM to collect the relevant technical marketing information and achieve advanced technology repeated orders over 30 machines in the tsmc technical node of 10nm, 7nm, 5nm, which created the total revenue over 4 billion USD.3. Performance and ability are well recognized in ASM with personal outstanding contribution award by two times in 2015 and 2017.4. Lead Piotech’s technical product of PECVD to successfully penetrate into tsmc 3nm process as co-baseline tool.5. With excellent proficiency and possess the patent of method for monitoring an ion implanter.

Country

Taiwan

City

Hsinchu City

Industry

Semiconductors

Skill

專案管理, 半導體, 半導體產業, 實驗設計, 統計流程管制 (SPC), 薄膜, 程序工程, 六標準差, PEALD, Epitaxy, implanter, Physical Vapor Deposition (PVD), RTP, Backside grinding, Furnace, Chemical Vapor Deposition (CVD), Coater, CMP

Experience

Technical Program/ Project Manager

Applied Materials

2022-11 - Present · 3 yrs 11 mos

Hsinchu

Project and program management Manage PMSA/MSA service contracts, optimizing resources to exceed KPIs and improve business margins. Lead global PM2 deployment projects across multiple Asian territories, including Japan, Korea, and Singapore. Execute High-Value Projects (HVP) and Continuous Improvement Programs (CIP) to maximize tool performance and customer satisfaction.

Technical & Product Service Manager / Business Development

Piotech Co.,Ltd 拓荆科技股份有限公司

2020-4 - 2022-11 · 2 yrs 8 mos

Hsinchu

Equipment maker company in semiconductor field Product support, business development, advanced technical penetration, manpower management, service support on CVD, PECVD, ALD, PEALD, SACVD products. Marketing Validation: Provided critical technical validation to spearhead PECVD product entry into TSMC’s 3nm integration flow, achieving co-baseline status. Technical Marketing: Conducted deep competitor analysis and CoO strategies to identify and expand business opportunities. Account Support: Managed engineering teams to support strategic global accounts, including UMCi and Silterra.

Group Leader / Project Leader

ASM

2007-3 - 2020-4 · 13 yrs 2 mos

Hsinchu

Furnace Epitaxy PECVD, PEALD Process sustaining, optimization, new process introduction, training, penetration, project leader Joint venture development and penetration with tsmc on N20, 14, 10, 7, 5 and 3 nm on Epitaxy, PEALD applications. Technical Sales Support: Contributed to a team-wide achievement of $4B+ USD in revenue by securing 30+ tool orders for TSMC’s 10nm, 7nm, and 5nm nodes. Process Innovation: Introduced advanced PEALD technology into Tier-1 foundry environments for high-volume manufacturing. Leadership: Directed process teams in PEALD, Epitaxy, and Furnace CVD, overseeing joint development projects and troubleshooting.

Senior Process and Application Engineer

SCREEN SPE USA

2005-3 - 2007-3 · 2 yrs 1 mo

Hsinchu

Responsible for Coat/Develop Track Process sustaining, optimization, trouble shooting Managed Coater/Developer Track and Wafer Cleaning systems, focusing on new tool evaluation and qualification.

Failure Analysis and Yield Improvement Engineer

POWERCHIP TECHNOLOGY CORPORATION

2003-3 - 2005-3 · 2 yrs 1 mo

Hsinchu

Failure analysis, yield improvement, integration process failure analysis Conducted yield improvement and root cause analysis using SEM, FIB, and EDX. Optimized thin-film processes through DOE methodologies.

Thin Film Process Engineer

MOSEL VITELIC INC.

2001-3 - 2003-3 · 2 yrs 1 mo

新竹

Process control, Process Optimization Responsible for CVD, PVD, Implanted, CMP, RTP, Backside grinding, E-gun coating. Conducted yield improvement and root cause analysis using SEM, FIB, and EDX. Optimized thin-film processes through DOE methodologies.