Hui Lu

Developing emerging NVM technologies @ Hisilicon

About

I have about 15 years of working experiences in eNVM development, including both traditional eFlash technology and emerging memory technology, like MRAM and RRAM, with coverage from TQV design, Process development, Device design and characterization, Test environment setup, Macro design and validation, Process and IP qualification, Production line planning, Customer solution support and Team management.

Country

City

Singapore

Industry

Semiconductors

Skill

R&D, Molecular Beam Epitaxy, Sputter Deposition, Magnetic Recording, Thin Films, Microfabrication, Matlab, Sensors, OriginLab, XPS, Magnetics, Powder X-ray Diffraction, Semiconductors, Scanning Electron Microscopy, Materials Science, Nanomaterials, Physics

Experience

Technical Expert

Hisilicon

2022-7 - Present · 4 yrs 3 mos

Shanghai, China

To lead a team to develop RRAM technology from 0 to 1. Job scope includes TQV design, Process Flow design, Process development, Test Environment setup, Macro design and validation, CP Test and analysis, Process and IP Qualification, Customer solution

Senior Manager

HFC Semiconductor Corp.

2020-2 - 2022-7 · 2 yrs 6 mos

Shanghai, China

To lead a team to co-develop MRAM technology with a well-known international research institute and transfer the R&D results to a local fab. Job scope includes MRAM technology analysis, Product definition and design, JDA R&D SOW and milestone management, production line planning, MRAM technology validation

Senior Product and Test Engineer

Everspin Technologies

2016-6 - 2020-2 · 3 yrs 9 mos

Singapore

To develop 256Mb DDR3 and 1Gb DDR4 standalone MRAM product via joint collaboration with our foundry partner. Job scope includes MRAM device development, CP Test and Analysis, Memory array characterization, and Yield improvement. SKILLS: JMP, Python, ATE Tester

Specialty Technology Development Staff Engineer

United Microelectronics Corporation (UMC)

2014-3 - 2016-6 · 2 yrs 4 mos

Singapore

To develop NOR type eflash memory on 55/40 nm logic platform. Job scope includes GDS tape-out, Process integration (FEOL and BEOL), Device characterization and yield analysis. SKILLS: FMEA, SPC, Six sigma, 8D report

Research Fellow

National University of Singapore

2012-10 - 2014-3 · 1 yr 6 mos

Singapore

To explore novel magnetic materials for MTJ application. Job scope includes thin film deposition, MRAM device fabrication and characterization. ACHIEVEMENTS: successfully achieved novel Heusler alloy thin film and utilized it in MTJ structure. SKILLS: Sputtering, TEM, XRD, SQUID, VSM, AFM, MOKE, Cryostat, CIPT.

Research scholar

Data Storage Institute

2008 - 2013 · 5 yrs

Singapore

As an attached research scholar of DSI to work on MRAM related project.

Laboratory demonstrator

National University of Singapore

2009-1 - 2012-5 · 3 yrs 5 mos

Singapore

Undergraduate module "Optical absorption in semiconductor" Students are taught to measure semiconductor bandgap using optical absorption method and determine the type of bandgap (about 20 classes per semester).

Teaching assistant

National University of Singapore

2009-1 - 2010-5 · 1 yr 5 mos

Singapore

Graduate module "Semiconductor Fundamentals" Assignment marking and tutoring.

Education

National University of Singapore

Electrical and Electronics Engineering

2008 - 2012 · 4 yrs

Thesis title: Investigations on Exchange Bias Effect in MBE-grown Transition-metal Chalcogenide CrTe Thin Films  depositions of novel magnetic thin films by MBE  characterizations on magnetic and structure properties.  low temperature magnetotransport study by Cryostat.

Nanjing University

Physics

2004 - 2008 · 4 yrs

Thesis title: Investigation of Cu1-xMnxO diluted magnetic semiconductor Prepared by PECVD.  depositions of diluted magnetic semiconductor (DMS) by Plasma-enhanced chemical vapor deposition (PECVD).  Characterizations using XRD, Energy-Dispersive X-ray Spectroscopy (EDS), Scanning Electron Microscope (SEM) and SQUID.