Hidetoshi Inoue
Material Development Engineer
Japan
Tochigi
Research
Molding Compound, Resin design, Assembly process, Failure analysis
Experience
Material Development Engineer
TSMC Japan
つくば
Packaging Engineer
Texas Instruments Japan | Kilby Labs
東京
・Developed new molding compound in cooperate with vendor, and led to mass production. ・Developed inductor integrated Power module for DCDC converter. ・Established isolation paths to avoid IC short. ・Prototyped new inductor/module samples, >30 varieties. ・Established MagPack technology and successfully launched MagPack modules to the market. ・Received MGTS in 2025.
Materials Engineer
Resonac
日本 茨城県
My expertise is molding compounds. I worked at Hitachi Chemical around 9 years, and I have experiences in developing Liquid type ,Solid type and Magnetic molding compound.
Education
Kyushu Institute of Technology
Materials Engineering
Hidetoshi Inoue's Contact Information
Phone
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