Li(Gill) G.

I focus on expanding Multek's North American footprint within the AI hardware and infrastructure market.

I'm reponsible for all the business development activities in North America.

• Managed daily flex, rigid-flex and HDI PCB RFQ/RFX from customers and provided timely responses. • Delivered flex PCB DFM support, successfully guiding programs from NPI to mass production. • Evaluate supply chain risks and implement contingency plans to ensure uninterrupted NPI production. • Launched GTM for Zecheng’s proprietary any-layer HDI process with RCC material (Resin Coated Copper); conducted engineering roadshows and DFM/DFX sessions; securing design-in approvals at Tier 1 customers. • Expanded market presence through participation in OFC (US) and CIOE (China), promoted Zecheng’s innovative HDI process + RCC material.

• Led sales & marketing (online campaigns, partnerships, basic CRM), building a predictable pipeline and improving inquiry-to-enrollment conversion. • Set budgets and pricing, managed cash flow, and kept the business sustainably profitable. • Negotiated supplier and lease agreements; optimized spend while maintaining education quality.

• Grew the North America and Europe business by building technical and commercial trust with Tier-1 OEMs and EMS in datacenter (servers/switches → up to 44L PCB using M6-7 level high speed materials with multiple backdrills /HDI /hybrid design) and automotive (ADAS/infotainment → 8-14L plus 1-4 HDI PCB). • Scaled revenue from $5M to $50M, winning multi-year agreements by aligning PCB capability (High layer count multilayer and HDI PCB) with customer’s technology roadmap and supply chain goals. • Partnered with customer and factory engineers on DFM/DFX (material selection/bidding, panelization, layout optimization) to increase yield rate and reduce cost. • Hosted and joined annual technical summit by Founder and customers to update technology development roadmap. (high-speed material, Signal Integrity, chip design development, PCB design.) • Led quarterly and yearly negotiations on pricing, Incoterms, payment terms

• Grew strategic OEM/EMS accounts and served as the commercial and technical bridge across Engineering, Manufacturing, Supply Chain, Quality, and Customer Service. • Scaled portfolio from $1M to $6M, expanding multilayer and hybrid (FR4 and Rogers) PCBs programs through disciplined account planning and pipeline reviews. • Acted as day-to-day liaison; translated customer specs into factory-ready requirements (drawings, impedance tables, stack-ups) and make daily quotations. • Flagged capacity and material risks early; coordinated alternates and expedites to protect NPI to MP schedules. • Organized customer QBRs and factory tours.