geoffrey post

* Developed and improved hybrid-electronic assembly processes, including pick and place, solder paste print, die attach, wire-bond, dispense and reflow. * Programmed, maintained and designed custom tooling for various automated assembly equipment, meeting production requirements. * Increased capability and capacity of production line by refurbishing aging assembly equipment.

Developed and improved hybrid electronic assembly processes specializing in PCB lamination, wire-bonding and wafer dicing. Specified, purchased, and performed buy-off evaluation of automated assembly equipment. Achieved 75% cycle time reduction and high-frequency bonding capability by working with equipment producer in Japan, meeting requirements for modification of wire-bonding equipment hardware and software. Fulfilled critical requirement for production tracking system by developing specifications for custom-laser marking system for engraving barcodes on PCBs. Participated in the successful launch of high-volume production facility in Suzhou, China by training process engineering staff.

Assisted process engineering with development, documentation and implementation of hybrid electronics assembly processes. Trained assembly operators and supported production in high volume operation. Fabricated prototype TCXOs and developmental test systems in support of design team. Completed coursework for BSEE while working as a technician. Participated in the transfer of production to Tianjin, China facility.

Performed assembly and test operations in high volume production of TCXOs.

Provide technical support for pre- and post-sales customers of solder products for electronics manufacturing. Assist sales personnel with technical knowledge of products during visits at customer sites. Perform testing of customer materials for compatibility or failure analysis in applications lab. Represent Kester at trade shows. Responsible for Kester technical support throughout North America.

Developed and improved electronics manufacturing processes in low-volume, high-mix SMT assembly operation. Participated in development and implementation of quality systems and served as member of quality issue review board. Specified and purchased new assembly equipment and upgraded existing equipment. Evaluated and selected assembly materials. Interfaced with product design team for DFM. Improved quality documents by standardizing all manufacturing process documentation and participating in design and implementation of document control system based on ISO standards. Enabled capable QFN rework process on high density assemblies by developing specialized direct component paste printing method. Implemented product reliability solution to remove all flux residues on assemblies by evaluating PCB cleanliness and developing, optimizing, and introducing aqueous batch cleaning process. Solved capability and capacity limitations by coordinating and qualifying outsourced rework and specialized component modification.

Developed and improved warehouse management and inventory control processes. Led cross-functional teams, developing time and cost-saving methods for tracking, storage, and delivery of home improvement materials using Six Sigma DMAIC tools. Participated in specification and implementation of EIMS (Empire Inventory Management System). Optimized warehouse product flow using 5S and product sales data analysis. Managed successful warehouse reorganization, inventory system implementation, and personnel training projects at locations across U.S. and Canada, while maintaining corporate roll-out schedule. Led development of bath product line inventory requirements, enabling implementation into EIMS. Led on-schedule, zero-inventory loss warehouse relocation events in two major markets.

Lead process engineer for multi-chip die bond process in MEMS-based microphones. Developed capable assembly processes for mass production (3B+/yr). Supported NPI by design of custom tooling, introduction of new materials, modification of assembly equipment and/or purchase of new equipment and development of new assembly techniques. Supported factories in China and Malaysia through weekly joint-engineering team conference calls. Supported customer product requirements through development of soft MEMS die attach epoxy process. Reduced die-to-die placement gap minimum to 150um by implementing new epoxy dispense tooling and epoxy control techniques. Supported package size reduction by developing and implementing die attach process using die attach film (DAF). Developed stacked die process capability through new equipment specification and purchase, process development and optimization of die stack assembly and die placement accuracy control requirements.