Ekta Brahmkshatri

Ekta Brahmkshatri

[Senior Staff] TPU AI/ML Infrastructure - Lead TPM for next gen TPU system @ Google

About

With extensive experience in hardware infrastructure and over 15 years in the field, I specialize in Technical Program Management for complex and highly cross-functional cloud infrastructure programs. At Google, I lead efforts to drive groundbreaking advancements in TPU AI/ML infrastructure, including next-generation systems designed for large-scale AI applications. My expertise lies in Infrastructure program/product management, data centers, and cross-functional team leadership, enabling efficient planning and execution from concept to production. Committed to innovation and collaboration, I focus on delivering energy-efficient, high-performance solutions that address the growing demands of the AI industry.

Country

United States

City

San Jose

Industry

Computer Hardware

Skill

Product Management, Data Center, Cross-functional Team Leadership, Analytical Skills, Presentation Skills, Strategic Planning, Enterprise, Problem Solving, Critical Thinking, Verilog, Microprocessors, Semiconductors, Application-Specific Integrated Circuits (ASIC)

Experience

Google

[Senior Staff] TPU AI/ML Infrastructure - Lead TPM for next gen TPU system

Google

LinkedIn
2025-10 - Present · 1 yr

San Francisco Bay Area

Google

[Staff] TPU AI/ML Infrastructure - Lead TPM for Ironwood (v7) TPU system

Google

LinkedIn
2022-4 - 2025-9 · 3 yrs 6 mos

Keynote Announcement: Sundar Pichai announced Ironwood at the Google Cloud Next 2025 conference in Las Vegas. Performance: It is designed for the "age of inference," with 10X the peak performance of the previous TPU v5p and over 4X better performance per chip compared to the Trillium (v6e) TPU.Scale: Ironwood pods can scale up to 9,216 chips, allowing formassive, interconnected computing power for large language models. Purpose: It aims to reduce reliance on Nvidia GPUs and provide a more energy-efficient (29x more than the 1st gen) and cost-effective solution for running AI applications. Adoption: Major AI players, including Anthropic, are planned to use up to 1 million of these chips for their Claude models.

Google

[Senior] TPU AI/ML Infrastructure - Lead TPM for v5 inference TPU sytem

Google

LinkedIn
2021-10 - 2022-3 · 6 mos
Google

[Senior] Cloud DataCenter Infrastructure TPM

Google

LinkedIn
2020-9 - 2021-9 · 1 yr 1 mo
Google

Cloud DataCenter Infrastructure TPM

Google

LinkedIn
2019-7 - 2020-9 · 1 yr 3 mos

San Francisco Bay Area

Apple

Technical Program Manager, Cloud Computing

Apple

LinkedIn
2018-9 - 2019-7 · 11 mos

San Francisco Bay Area

- Work with customers to gather new feature requirements; communicate these requirements to the engineering team; put the plans together for delivery dates and track progress. - Manage new h/w deployment projects working with vendors and the infrastructure team. - Lead operations team to maintain a minimum amount of h/w down in the datacenter.

Intel

Data Center Strategic Planner

Intel

LinkedIn
2016-4 - 2018-8 · 2 yrs 5 mos

Santa Clara, California

• Understand customer/user requirements and lead cross functional teams including engineering, marketing and finance to deliver product strategy for Server hardware infrastructure programs • Engage with key OEMs/ODMs, identify market opportunities, build business cases and define product vision and strategy. • Primary program liaison to internal and external teams to identify gaps, provide solutions or workarounds, communicate status and schedule updates. • Manage business risks through the program planning cycle by providing creative alternatives. • Present product plans and options to company senior execs on a fairly regular bases. • Work closely with partners across the industry to identify opportunities and drive adoption.

Intel

Technical Marketing Engineer

Intel

LinkedIn
2014-9 - 2016-3 · 1 yr 7 mos

Santa Clara, CA

• Lead regular discussions with customers and provide them technical guidance through their product development cycle based on next gen Xeon SP server. • Act as the first point of contact for OEM technical issues and proactively resolve issues in order to build strong customer relationships. • Listen attentively to customer issues and resolve them with utmost empathy. • Work efficiently with various cross functional teams including engineering, marketing and sales in order to drive the product to success. • Resolve customers’ technical queries on day to day bases through online CRM tools. Work closely with engineering team to isolate, root cause and resolve particularly complex technical problems.

Intel

Component Design Engineer

Intel

LinkedIn
2006-3 - 2014-8 · 8 yrs 6 mos

Santa Clara, CA

Intel

Circuit Design Intern

Intel

LinkedIn
2005-5 - 2006-2 · 10 mos

Folsom, CA

Education

California State University-Sacramento

California State University-Sacramento

LinkedIn

EE

For the masters project, designed a ring oscillator as a part of PLL chip which was fabricated through TSMC and was proven functional on a silicon.

Ekta Brahmkshatri's Contact Information

Email

******@***.com

Phone

(**) *** ****

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