doug feicht

nanoCoolers developed thin film thermoelectric devices for localized chip cooling and liquid metal heat transfer solutions for the military, telecommunications, and computer industries. As second of forty employees, I developed initial commercialization plans and customer relationships required to release initial capital “traunches”. Held a range of engineering roles, including design of initial prototypes, process development of brazing, assembly, sealing processes, prototype sourcing, validation testing, and project management.

Performed market research and analysis on microelectronics assembly and semiconductor package segments for a small market research company. Authored “High Density Microvia Substrates: Worldwide Developments” multi-client report, as well as numerous industry publications and single client reports. Specialized in process and equipment content for “BGA/CSP Update”, a quarterly journal publication. Other project topics included wireless, multi-chip, flip chip bonding, wafer-level packaging, micromechanical systems (MEMS) and optoelectronic packaging. Organized and hosted technology workshops for advanced package technology.

Motorola Manufacturing Systems. Established new engineering office in Phoenix charged with developing automated manufacturing equipment for semiconductor packaging applications for Motorola and subcontract assembly manufacturers. Responsible for market development for manufacturing systems to produce Ball Grid Array (BGA) modules and Chip-Scale Packages (CSP) which were important enablers for cell phone miniaturization. Achieved market share leadership as demand took off and Asian subcontractors invested heavily in new technology. Program management (technical proposals, concepts, pricing and project management) for custom automation for microelectronics packaging operations, including BGA package assembly, device handling, solder jetting, and high performance image processing.

* Functional leader for new process/equipment development team for supercomputer interconnect packaging, including flip chip, liquid cooling, ultrasonic wire bonding and laser ablation of thin films. * Manager of engineers responsible for design, planning and build of Excimer Laser (308nm) ablation tools and optics for thin film circuits * Team leader for development and support of robotic/vision equipment for flip chip placement and module assembly of IBM’s Thermal Conduction Module (TCM). * Manager of engineers responsible for manufacturability of new printed circuit boards and process introduction of new surface-mount packages, including tape-BGA modules for high I/O processors.

The Denali Group was founded in 2015 to focus on technology commercialization, with interests in automotive, microelectronics and cognitive computing. The company applies proven technology commercialization processes to help move a technology from a mere idea toward a developed commercial product with validated market advantages and sustainable revenues.

Activities and Societies: Manufacturing Systems