Dongming Iu
Mechanical Engineer @ Applied Materials
About
Over 25 year experience in semiconductor capital equipment design and system engineering. Expertise in mechanical design, electrical & software integration, sensors, atmospheric & vacuum system, thermal and fluid. Demonstrated ability to lead multi-function team to achieve program goal.
United States
Santa Clara
Semiconductors
Mechanical Engineering, Failure Analysis, Metal Fabrication, Semiconductor Industry, Design Engineering, 3D Computer Aided Design (3D CAD), Product Design, Machine Design, Semiconductor Equipment, Solid Modeling, Design for Manufacturing, Heat Transfer, Sheet Metal, Unigraphics, Inventor, Finite Element Analysis, DFM, Teamcenter, Manufacturing Engineering, Thermal
Experience

Mechanical Engineer
Technically led and executed the development of the heater based anneal chambers on a high throughtput platform. Achieved multiple key customer acceptance. Provide critical engineering support during customer penetration, tool qualification, start up and continue to provide unique solution to solve customers’ high value problems. Responsible for chamber and related integration design for next generation RTP tool. Work with cross-function team to define spec, design, build and test prototype chambers. Key contributor to numerous CIP projects, including low temp oxidation & selective oxidation for RTP chambers. Significantly extend the chamber capability and brought in multiple retrofit orders after CIP implementation. Responsible for all phases of gas panel design, including flow schematics, component selection, new components qualification and enclosure design. Also create BoM and retrofit procedures for customers. Develop gas and liquid delivery systems for RTP systems. Provide unique solutions to support new processes as required by customers. Generated a full system layout for next generation RTP tool during C&F stage and defined critical system integration dimensions. Also, manage offshore engineering team to create and maintain complete 3D models for current systems in production.

New Product Manufacturing Engineer
Managed 3 complex modules for ECP tool. Responsible for BoM creation and maintenance, assembly and testing procedure. Also managed contract manufacturing vendor for material, manufacturing and quality issues. Supported new product commercialization, manufacturing strategy, engineering change management, and volume manufacturing transition for ECP division. Extensive experience in plastics components design and manufacturing processes. Initiated and implemented design changes to improve the manufacturability, assembility and to reduce the cost of the new products. Provided short and long term solutions to manufacturing floor issues related to designs, configurations, assembly and testing procedures for ECP products. Excellent knowledge in engineering change order (ECO) process and product data management (PDM) system.

Manufacturing Engineer
Provided engineering support, including fixture, tooling and machine programing for wire bonding and vision inspection processes. Analyzed failure modes of products, fundamentally eliminated wire bonding related failures of ribbon interposers by redefining the shape of the Microspring. Qualified vendors, generated qualification reports for key supplies such as gold wire and capillary, resolved vendor related issues.
Dongming Iu's Contact Information
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