Divya Kiran Kadiyala

Divya Kiran Kadiyala

AI Performance Architect @ Hewlett Packard Enterprise

About

*I am always excited to connect with researchers, engineers, and collaborators working on next-generation memory and computer system architectures. If my background aligns with your interests and you would like to collaborate, please feel free to reach out via email at dkadiyala3@gatech.edu or connect with me on LinkedIn.* Website: https://dkadiyala3.github.io I am an AI Performance Architect with expertise in computer architecture, memory systems, distributed AI/ML platforms, and high-performance computing. My work focuses on architecting and evaluating scalable systems for next-generation AI and scientific workloads, with emphasis on performance modeling, memory hierarchy optimization, interconnect analysis, and hardware-software co-design. I completed my Ph.D. in Electrical and Computer Engineering at Georgia Tech under the guidance of Dr. Alexandros Daglis. My doctoral research focused on tailored memory system architectures to improve the performance of parallel, scientific, and AI/ML workloads in resource-constrained and memory-bandwidth-intensive environments. My work drew on computer architecture, memory system design, distributed AI/ML systems, and CXL-based technologies to reduce the gap between compute capability and data movement in modern datacenter and cloud platforms. In my current role, I architect and evaluate high-fidelity performance models for AI/ML workloads on large-scale distributed systems, generating insights that improve throughput, reduce latency, and guide future system design. My work also includes R&D for next-generation HPC and supercomputing architectures, post-Exascale roadmap development, and designing cycle-accurate simulators and emulation platforms to evaluate SoC subsystems and multi-node architectures. Prior to my Ph.D., I earned my M.S. in Electrical Engineering from Arizona State University and worked as a Senior Applications Engineer at Cadence Design Systems, San Jose. There, I specialized in power sign-off solutions for memory macros, ASICs, and SoCs, developed methodologies for the Voltus® IR & EM power sign-off tool, correlated power-grid abstractions with SPICE results, and collaborated with R&D teams to improve analysis accuracy and performance. Technical Skills: - Programming Languages : C, C++, CUDA, Perl, Python, System Verilog, Bash Scripting - Performance modeling : ZSim, ASTRA-Sim, DRAMSim, gem5, SESC, Garnet2.0 - HPC & AI Tools : MPI, OpenMP, NCCL, Tensorflow, PyTorch, Keras - Processor Architectures : X86, RISC V, GPU, TPU, dataflow architectures

Country

United States

City

Atlanta

Industry

Electrical & Electronic Manufacturing

Skill

High Performance Computing (HPC), Distributed AI/ML Systems, System Architecture, Artificial Intelligence (AI), Computer Simulations, System C, Microarchitecture, RISC-V, Power Sign-off, Cadence Voltus, EM/IR, EDA flow, Test Design, Post Silicon Validation, CXL, Research Skills, Deep Learning, CUDA, Performance Modeling, Distributed Training

Experience

Hewlett Packard Enterprise

AI Performance Architect

Hewlett Packard Enterprise

LinkedIn
2026-2 - Present · 8 mos

Milpitas, California, United States

– Architect and evaluate high-fidelity performance models for AI/ML workloads on large-scale distributed systems, driving throughput improvements and latency reductions. – Lead R&D on next-generation HPC/supercomputing architectures, addressing high-impact computational requirements across scientific and industrial domains. – Define technical roadmaps for post-Exascale systems by benchmarking emerging hardware/software stacks and analyzing advanced interconnect and memory technologies. – Design and implement cycle-accurate simulators and emulation platforms to validate SoC subsystems and multi-node architectures, enabling evidence-based design trade-offs. – Drive intellectual property creation by identifying patentable innovations in hardware acceleration and distributed-system methodologies and supporting invention disclosures/filings. – Publish peer-reviewed research in top-tier venues, advancing the state of the art in computer architecture and high-performance computing.

Hewlett Packard Enterprise

Research Intern (Part-time)

Hewlett Packard Enterprise

LinkedIn
2024-8 - Present · 2 yrs 2 mos

Milpitas, California, United States

Working on improving memory efficiency and scalability of AI/ML Training leveraging CXL memory

Hewlett Packard Enterprise

Research Intern

Hewlett Packard Enterprise

LinkedIn
2024-5 - 2024-7 · 3 mos

Milpitas, California, United States

Worked as Summer Research Intern at HP Labs in Networking and Distributed Systems Group.

Samsung Semiconductor

Systems Technology Research Intern

Samsung Semiconductor

LinkedIn
2022-5 - 2022-8 · 4 mos

San Jose, California, United States

Worked as Research Intern in Memory Solutions Lab at Samsung Semiconductor Inc. https://samsungmsl.com/

Luminous Computing

CPU Architecture Intern

Luminous Computing

LinkedIn
2021-5 - 2021-8 · 4 mos

Worked on RISC-V based microprocessor architectures for domain specific AI accelerators.

Cadence

Sr. Applications Engineer

Cadence

LinkedIn
2017-7 - 2019-7 · 2 yrs 1 mo

San Jose

At Cadence Design Systems, I worked on IR and EM power sign-off tools, collaborating closely with R&D and product engineering teams to develop novel flow methodologies and new feature enhancements for the Voltus® power sign-off tool. My primary focus was on power-grid abstraction and its correlation against SPICE simulations to ensure accuracy and scalability across large SoC designs. I also provided technical support and solution development for Voltus® power sign-off issues for a major hardware company in the Bay Area, helping improve analysis performance and sign-off confidence.

Arizona State University

Student Research Aide

Arizona State University

LinkedIn
2016-11 - 2017-7 · 9 mos

#331, ASU VLSI Research Lab, Gold Water center for Science and Engineering

I worked as a Student Research Aide at the VLSI Research Lab, Arizona State University, under the supervision of Dr. Lawrence T. Clark. As part of the TC25 research project, I conducted extensive testing and data analysis on TC25 SRAM memory arrays, collecting data from fabricated test chips and performing statistical analysis to characterize device behavior and variability. This work resulted in two IEEE journal publications. Key Contributions: 1. Investigated SRAM-based Physically Unclonable Functions (PUFs) for device authentication and security. 2. Analyzed random telegraph noise (RTN) effects on SRAM bit-cell stability under varying process and voltage conditions. 3. Designed and executed experimental setups for 6T SRAM blocks on the TC25 test chip, performing detailed data acquisition and analysis. 4. Developed Perl scripts to automate data parsing and statistical analysis workflows for large-scale test data. 5.Designed the physical layout of an LRU register file supporting the Tag Array using the 7nm ASAP predictive FinFET PDK.

Tata Consultancy Services

Assistant System Engineer

Tata Consultancy Services

LinkedIn
2013-10 - 2015-4 · 1 yr 7 mos

Chennai Area, India

Worked as Junior SAP Consultant in SAP User administration and SAP security. - Performed troubleshooting in the technical issues related to SAP ERP Roles and Authorizations. - Performed monthly periodic review and audit works in compliance to organization's Information Security policy. - Performed user administration activities and provided active support to end users. - Prepared the technical and process related documents for Business to review.

Education

Georgia Institute of Technology

Georgia Institute of Technology

LinkedIn

Electrical and Computer Engineering

2019 - 2025 · 6 yrs
Arizona State University

Arizona State University

LinkedIn

Electrical Engineering

2015 - 2017 · 2 yrs
KL University

KL University

LinkedIn

Electronics & Communications Engineering

2009 - 2013 · 4 yrs

Studied Electronics and Communication Engineering.

Divya Kiran Kadiyala's Contact Information

Email

******@***.com

Phone

(**) *** ****

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