Dinesh Annayya

Dinesh Annayya

Co-Founder & Head of Silicon Engineering @ BigEndian Semiconductors

About

Semiconductor engineering leader with 25+ years of hands-on experience driving complex ASIC and SoC development, spanning architecture to silicon bring-up. Demonstrated expertise in design, verification, DFT, and timing closure across advanced nodes from 180nm to 10nm. Experience contributing to product development at Arcus, Cypress, Centillium, Transwitch and Intel. Strong domain background in processors, optical communication, networking, and telecom, delivering robust silicon solutions for high-performance systems.U.S. Patent – High-Speed CRC Computation for Networking Applications U.S. Patent – Generic High-Speed Packet Classifier/Parser Architecture for Networking Systems

Country

India

City

Bengaluru

Industry

Telecommunications

Skill

VLSI, IP Networking, Optical Communications, ASIC, Verilog, RTL design, FPGA, DFT, C, Ethernet, Telecommunications, Architecture, Validation, Debugging, SDH, Embedded Systems, System Architecture, SystemVerilog, VoIP, Integration

Experience

BigEndian Semiconductors

Co-Founder & Head of Silicon Engineering

BigEndian Semiconductors

LinkedIn
2024-5 - Present · 2 yrs 5 mos

Bengaluru, Karnataka, India

building semiconductor solutions in the surveillance cameras for enterprise and consumer applications

Intel

Director Of Engineering

Intel

LinkedIn
2019-5 - 2023-9 · 4 yrs 5 mos

Bengaluru, Karnataka, India

Intel

SOC Design Lead

Intel

LinkedIn
2017-1 - 2019-5 · 2 yrs 5 mos

Bengaluru Area, India

Asarva Chips and Technologies

Senior Techinical Consultant (Weekly 2 Days)

Asarva Chips and Technologies

2015-1 - 2016-12 · 2 yrs

Bangalure, India

SOC Architecture & Integration for wireless Chip

Orca Systems, Inc.

Senior ASIC Consultant (Weekly 10 Hours)

Orca Systems, Inc.

LinkedIn
2011-10 - 2016-12 · 5 yrs 3 mos

Bengaluru Area, India

Coordinated 65nm SOC Design,Verification,Synthesis, BIST, SCAN, JTAG and STA activity for a universal TV tuner chip. Activity includes: > Top-level Architecture > Sub block integration - DSP Processor, SDRAM, I2C, SPI, UART > FPGA integration support > DFT methodology/Debug - BIST, JTAG, Full/Compression/OPCG SCAN > Logic Equivalent Checker issue debug > Static Timing fixes > Gate level simulation debug

Transwitch

Manager

Transwitch

LinkedIn
2009-4 - 2011-3 · 2 yrs

Bengaluru Area, India

Project: Atlanta chip sets (A1000/A2000) Description: The Atlanta A1000/A2000 communications processor delivers wire speed IEEE 802.11n WiFi performance and carrier-grade Voice-over-IP (VoIP) with the lowest power consumption and bill-of-materials (BOM) cost of processors in its class. It supports a wide range of applications including voice-enabled gateway routers for home and small office use, as well as IEEE 802.11n WiFi access points. Contribution:  Managed full chip india design/verification team.  Top-level design integration  Full chip timing closure  Full chip DFT-BIST/JTAG/SCAN Methodology.  System level chip bring-up.

Cee

Manager

Cee

LinkedIn
2003-7 - 2009-3 · 5 yrs 9 mos

Bengaluru Area, India

Project: EPON Mustang CPE Chip Sets (ME100/ME200/ME200BA/ME300) Description: The integrated, low power FTTH solution targets service providers deploying EPON in CPE, enabling the delivery of triple play services including IPTV. The Mustang chipset supports traffic management, classification and filtering for up to 256 multicast groups, and up to eight different service types. The Mustang chipset integrates packet buffer and program memories in a compact package. Contribution:  Developed full chip verification methodology.  Design of Bride Block  C based verification modules development.  Top-level integration  Full chip timing closure  Full chip DFT-BIST/JTAG/SCAN.  System level chip bring-up.

Cypress Semiconductor Corporation

Staff Design Engineer

Cypress Semiconductor Corporation

LinkedIn
1998-4 - 2003-7 · 5 yrs 4 mos

Bengaluru Area, India

1) Project: Design and Verification of POSIC2GVC Description: POSIC2GVC is part of Cypress Broadband chip-sets that incorporates SONET frame for OC48/PC12/OC3 with 16 port and UTOPIA, POS-PHY 3 link interface Contribution:  Design of 16 port Generic Frame Tagger block with gate count of 150K. This block has two level protocol comparator to parse and analysis the incoming packet. We have got US patent for the architecture.  Design of 16 port UTOPIA-3/POS-3 receive link layer interface.  Developed full chip verification methodology.  Designed a fast parallel CRC generator and we have received US patent for the same.  Synthesis and Static timing analysis of frame tagger and Utopia/Pos-phy link layer design.  Full chip Scan vector generation using tetramax  Full chip code coverage using HDLScore. 2) Project: Verification of DEMS Description: E1/T1 mapper for OC-1/OC3 SONET/SDH Contribution:  Verification of 8 bit Embedded Processor core. 3) Project: Software for E2/E3/E4 Multiplexer Description: PDH Multiplexer for E2/E4/E4 bit rates. Contribution:  Design and testing of system software written in C 4) Project: Software for E4 Optical Framer Description: PDH Optical framer of E4 bit rate. Contribution:  Design and testing of system software written in C

Deccanet Designs

Member Technical Staff

Deccanet Designs

LinkedIn
1997 - 1998 · 1 yr

Bengaluru Area, India

Project: Hardware and Software of fiber in transmission loop. Description: Fiber in transmission loop is 512 subscriber line concentrator to OC-1 rate on optical fiber. Contribution:  Design of control card  Design and testing of system software written in C

Education

National Institute of Technology Karnataka

National Institute of Technology Karnataka

LinkedIn

Industrial Electronics

1995 - 1997 · 2 yrs

Dinesh Annayya's Contact Information

Email

******@***.com

Phone

(**) *** ****

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