Dennis CHOI
Principal Engineer @ Broadcom
About
Packaging substrate technology development
United States
San Jose
Information Technology & Services
Semiconductors, Failure Analysis, Design of Experiments, Six Sigma, SPC, JMP, Engineering, Thin Films, Manufacturing, Electronics, Process Engineering, Cross-functional Team Leadership, Product Management, PCB Design, Project Management
Experience
Principal Engineer
Broadcom
San Francisco Bay Area
Packaging substrate technology development
Senior FAE, Technical Sales
Simmtech America
San Francisco Bay Area
- Assisting in managing PCB & Substrate products and other details of sales and service requests for providing to the customers for technical support - Analyzing technological problems, checking its technical resolution - Collaborating with sales team, engineers, and product managers for obtaining accurate information of application usage, system operations, and product management - Developing new business by providing total substrate technology solution
Sr. Engineer
Samsung Electro-Mechanics
S. Korea and Phoenix, Arizona Area
- Product development engineer of semiconductor packaging substrate
Education
Kyungpook National University
Materials sciences and engineering
Dennis CHOI's Contact Information
Phone
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