Daneskumar Manogaran, PMP®, ICBB
Senior Electroplating Engineer (Thin Film) @ Tata Electronics
About
Semiconductor electroplating and advanced packaging module/tool owner with 11+ years across Tata Electronics (leading technology transfer, greenfield fab start-up for 300mm copper electroplating module, bridging transfer source site to Tata’s new greenfield fab), Intel (Foveros-class 3D packaging brownfield startup and process transfer to high-volume manufacturing in New Mexico), Intel 300mm advanced packaging wafer fab greenfield start-up in Malaysia, high-purity Tin, Solder, & Copper metals electro-refining (Malaysia Smelting Corporation), and EMS quality/NPI (Flex). Specialized in wafer-level copper electroplating on 300mm tools (Lam SABRE / SABRE 3D), bath chemistry control tools (KLA PRIMA / LIBRA), edge-overplating/EBR tuning, process window definition, SPC/FDC/Fabguard integration/monitoring & control, and greenfield startup-to-HVM ramp. Proven record capturing and industrializing critical process knowledge, closing gaps between development sites and new fabs, reducing scrap and cost-per-wafer, PM automation and preparing shift teams to run autonomously. PMP® and Lean Six Sigma Black Belt (ICBB).
Malaysia
Penang
Semiconductors
Process Integration, Yield Management, Manufacturing Process Improvement, Microsoft Excel, Interpersonal Communication, SMT, Operational Excellence, Gemba, Production Efficiency, Operations, Capacity Planning, Critical Thinking, Surface Treatment, Product Development, Engineering Process, Construction Site Inspections, Processes Development, Troubleshooting, Technical Support, Customer Satisfaction
Experience

Senior Electroplating Engineer (Thin Film)
Taiwan
Leading electroplating technology transfer and qualification from Taiwan to India's first semiconductor wafer fabrication facility. Planning & driving installation, startup, qualification and optimization of advanced copper electroplating processes for 300mm wafer manufacturing. Collaborating with global equipment vendors and process experts to ensure seamless technology transfer, tool acceptance, and high-volume readiness. Supporting cross-functional teams in facilities readiness and tool & process matching, to accelerate India's semiconductor manufacturing capabilities.

Electroplating Module Engineer (Advanced Packaging)
Penang, Malaysia
Was assigned to start-up Intel's first 300mm wafer Fab in Malaysia (greenfield). Specialized in electroplating. Continously provided remote support to Intel New Mexico, United States on process & equipment qualification and troubleshooting. Experienced in 300mm wafer fabrication plating process. Lead and completed multiple tool automation projects for Intel US site remotely from Malaysia. Lead module level FMEA creation and maintenance. well versed with LAM Research Sabre/Sabre-3D tools. Refer to resume for further details.

Process Engineer (Acting Production Manager)
Experienced Process & Production Engineering Leader with a strong background in metal electrolysis, refining, manufacturing optimization, & process development. Successfully led metal electrolysis, crystallization, refining, and casting operations, ensuring high production efficiency and quality control. Proven expertise in process improvement and cost reduction, having increased 99.99% electrolytic tin production generating $875,000 in additional monthly revenue through process development projects. Pioneered an alternative tin purification process using crystallization & vacuum distillation, reducing production costs. Adept at Lean Six Sigma methodologies, process automation, and value stream mapping, which resulted in an 18% manpower reduction in casting operations and a 30% decrease in refinery downtime through strategic equipment maintenance. Strong leadership in quality assurance and compliance, achieving zero external rejects for three consecutive years (2018-2021) and successfully handling ISO audit recertifications (2019-2021). Managed a team of 1 production superintendent, 7 supervisors, and 5 assistant supervisors, ensuring smooth operations and continuous improvements. Passionate about driving operational excellence, cost savings, and high-quality manufacturing outcomes through data-driven decision-making, process optimization, and cross-functional collaboration.

Quality Engineer
Penang, Malaysia
1) Achievement Created a new RMA process flow by segregating RMA returns into 8 different groups & reach a mutual agreement with customer for the liability portion. Clear liability ownership, increased customer satisfaction & help Flex to save cost by clearly spelling out the clause customer induced damage liability. Roles & Responsibilities 1) Drive internal team for quality improvement as a team leader & analyze monthly quality performance. 2) Conduct product & process quality audit & ensure timely closure of all CAPAs. 3) Monitor NPI activity yield & provide complete quality package & drive RCCA or work to change de-sign in order to improve product quality before convert to sustaining product. 4) Prepare for line, UL, NEMKO, customer & all other annual audits from external parties. 5) Communicate with customer on all quality related issues. 6) Lead investigation for customer complain by providing RCCA, CAPA, 8D report, process mapping.

Engineering Intern
Ampang, Malaysia.
★ First intern to be awarded the prestigious Excellency Recognition Award(ERA) for handling the Raya Shutdown Project excellently. ★ Major tasks accomplished including utilities management, maintenance and process improvements for boilers and waste water treatment plant. ★ Designed a full boiler control system using SCADA & PLC which reduced annual diesel cost by 30-40%. ★ Lead a team of interns and solved a major pest control problem in production. ★ Update and revise SOP, handle monitoring and documentation of boiler and waste water system.
Daneskumar Manogaran, PMP®, ICBB's Contact Information
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