Prasanth Chilakamarri

Hardware Reliability Engineer (IC 6) Specialization: Reliability with plastic Housings, Vibration and temperature robust product development , Qualification of Camera (CCM modules, FPC etc), Flash memory (eMMC, NAND etc), Telematics (LTE, WiFi, Bluetooth, GPS/GNSS) and USB-C protocol related electronic components Projects: Vehicle gateways, AI Dascham , Automotive Outdoor mount AI Camera

Leading Electronic packaging (housing) design that enables embedded systems to meet stringent automotive Temperature, IP and vibration requirements Summary : Requirements Management, Risk Management, Cross Functional collaboration and User profile definitions additional to design for reliability Specialization: Reliability with plastic Housings, Vibration and temperature robust product development , Qualification of Flash memory (eMMC, NAND etc), Telematics (LTE, WiFi, Bluetooth, GPS/GNSS) , Ethernet and USB protocols related electronic components Projects: eMobility : LED display , 48V Battery package for 3 Wheelers IoT: Energy Management device for Refrigerators, Engine mount Edge analytics, Infotainment devices Telematics: Cabin Mount device for Passenger cars, ecall device for European, Japanese and South Korean Passenger car OEMs, First of its kind CV Engine Mount telematics device (IP69) also used for Genset , Mining and Railway applications , First of its kind IP66 telematics device for agriculture& construction equipment manufacturers with plastic enclosure In addition to Design for reliability (Next section of profile), roles and responsibility include - Defining ,documenting and maintaining requirements throughout the engineering design process - Identification, evaluation, and prioritization of risks in early project phases - Understanding evolving customer requirements and incorporating the same in development without much impact on timeline, cost - Drive Cross-functional collaboration, customers/supplier engagement and resolve issues - Prepare and participate in project quality gates, timeline planning - Develop standard methods, trainings and methodologies and ensure implementation within organization for competence development - Track defects/deviations , share lessons learnt and develop best practice guidelines - Plan application assessment, field measurements for better understanding of product use cases and loads expected

Summary: Thermal Management, Component selection, Design Improvements through simulations, Reliability Validations/Qualifications, Root cause analysis Roles and responsibilities Product Development  Participate in design reviews and engineering meetings to drive reliability initiatives.  Develop FMEA, FTA and Focus Analysis matrix for new developments and drive Impact analysis (DRBFM) for Variant projects to identify risks  Define the scope of Design of experiments (DoEs), physics of failure based simulations and propose design modifications to meet reliability goals and Field usage profile (FUP) Reliability of ICs/Semiconductors/ MEMS  Prepare Reliability block diagrams, Reliability allocations and support selection, qualification of components, new processes  Plan physics of failure based robustness validation for semiconductor/IC and SiP/SoC solutions  Develop lifetime acceleration models based on data analysis to define product life metrics (failure rate, lifetime etc using weibull++) Design Validation  Demonstrate Reliability by accelerated life tests (HALT, thermal cycling/shock, Random vibration, humidity, mechanical shock. IP etc)  Guide design and fabrication of test fixtures, Data acquisition for mounting location and application assessment  Lead Failure analysis efforts of test and field failures for root cause identification and CAPA implementation using problem solving techniques like 8D, 5Y / FRACAS Solid understanding of mechanical and material interaction effects on reliability of IC components and/or PCB assemblies, physics of failure and the effects of thermomechanical, thermal, mechanical and hygroscopic swelling stresses Knowledge of key standards used in reliability at component level and product level such as ISO 16750, AEC-Q 100/101/104/200, JEDEC , MIL, IEC

Worked on a research project in the field of Nonlinear dynamics at Nano/Micro Mechanics and Motion (NM3) Laboratory

Worked on a research project in the field of Nonlinear dynamics

Worked on AUTOCAD and SOLIDWORKS to develop a design of 3 spindle gear box

To gain exposure of basic functional setup of large scale Industry