Cristina Lopane

Tecnico di laboratorio presso laboratorio di Failure Analisys competenze: analisi non distruttive: x ray , xray3D, sonoscan analisi distruttive: decapping molding samples, deprocessing wet dry e parallel lapping, microscopia ottica e digitale, decapping dal retro , utilizzo acidi e solventi e patentino gas tossici. Process owner e tool owner area lab NDI ( non-distructive analysis) tool owner SAM300 Pva Tepla, Microscopia ottica Leica e Nikon, Nordoson Dage Quadra 7 ( Xray) Esecutore di modifica del circuito per attività semplici come punti di prova e attività complesse come tagli e cortocircuiti di qualsiasi tecnologia su Fib Fei V400 Techinician at Failure Analisys laboratory , competencies: Non-destructive analysis: x ray , xray3D, sonoscan Destructive analysis: Decapping Molding Samples, wet dry and parallel lapping deprocessing, optical and digital microscopy, reverse decapping, use of acids and solvents and toxic gas patent. Process owner and tool owner area lab NDI (non-destructive analysis) tool owner SAM300 Pva Tepla, Leica and Nikon optical microscopy, Nordson Dage Quadra 7 (Xray) Circuit modification executor for simple tasks such as test points and complex tasks such as cuts and shorts of any technology on Fib Fei V400