Chee Keong Wong

1. Provide guidance on the development of engineering process used in all New Product Introduction (NPI), manufacturing operation and the analysis on Design for Assembly (DFA); 2. Interface with engineering group leaders to make decision on product lines, the tactical and strategic planning of engineering process development; 3. Direct and manage Process Engineers’ coordination activities with Manufacturing Engineers during the phases of product development to define and develop manufacturing process instruction, tooling and fixtures, process cycle time and cost analysis; 4. Oversee the manufacturing of prototype product or system, review test data and report to determine if design meets functional and performance specifications; 5. Confer with research engineering personnel in research diagnosis, troubleshoot and resolve complex technical process/device issues in a manufacturing environment; 6. Direct engineering analysis to establish quality control guidelines for future mass production; and to increase productivity, enhance yields, reduce machine down time and review failure analysis and parametric tests

Main Duties: • Head of Process Engineering Group. Job description is to lead a team of Process Engineers to ensure the smooth running of production floor. Main tasks include yield and turn around time improvement, reduction of unit cost by carrying out cost avoidance/reduction activities and implement new projects for process continual improvement. • Head of production group. Job description is to lead the production team consisting of operators, technicians, leaders and supervisors in daily operation of the production floor. Main task is to run operation to achieve daily output with high yield. • Head of Maintenance group. Job description is to lead the team in managing equipment predictive and preventive maintenance to ensure all equipments are in good running condition with minimal breakdown. • Head of Package Development Group. Job description is to lead a team of NPI Engineers in evaluation and qualifying of new packages, new wafer technology devices, raw materials and new packaging technology. Sub Duties: • Developed, implemented and maintained SPC systems • Ensure successful implementation of new technologies, processes, machines, and raw materials for cost avoidance/reduction purposes and improvement of production lines to maximize quality and shorten cycle-time. • Administered and implementation of specifications, standards and procedures for smooth running of production lines. • Monitored and maintained TS16949, ISO 9002 & ISO14001 in Assembly Department.