Chun-Hsiang Hsu

* IEEE 802.11 Wi-Fi 6/7/8 and 802.15 IoT (BT, Zigbee, Thread) RF hardware schematic design (OrCAD) for AP, FWA, and CPE products. * PCB layout routing review (Allegro PCB viewer) * Signaling and non-signaling test (Tx Power, EVM, Rx sensitivity, RvR, RvRvO, throughput …) * RF tuning to obtain better performance * Regulations (FCC, CE, IC...) pre-scan and review relevant draft reports from labs * De-sense / EMI issue debug * Issue test reports with Award: First Place in MP Project RF Report, 2024 * Cross-function team work with business (marketing, sales, PM), engineer (ME, EE, PE, SW, antenna), material (sourcer, cost) and outsource engineers, FAE * DFM with internally (factory site) and outside PCB vendors * Prepare RFQ data (RF link budget, power consumption, thermal, PCB placement, BOM) to business team and PRD discuss with customers and internally * BOM cost review and reduce, 2nd source survey and approve * handling the product development time slot and QA during the meeting * Clients: global tier 1 telecom network operators and LEO company

* IEEE 802.11 and IEEE 802.15 RF hardware schematic design * PCB layout routing review * Discuss RFQ and PRD with customers and internally * RF performance test to fulfill products requirement and issue test reports * Antenna performance review and discussion with venders * De-sense / EMI issue debug * Co-work with ME, EE, PE, SW, PM, sales and outsource engineers * Major projects and customers: a) IPCAM, ecobee, Canada, b) Doorbell, Wyze, USA, c) Chime, SkyBell, USA

* A startup company * Manage hardware design team and define SOP * Wireless SiP module and EVB design * Marketing survey and production promotion

* Award: First Place in 2017 Innovative Technology Competition * In charge of Wi-Fi/BT and GNSS SiP (System in Package) module design for Apple Inc. * Prepare proposal and technical support to Apple * EVB design: schematic and layout for R&D, customer, module, reliability, NPI and MP production lines * Second source selection and BOM maintain * Leading cross-functional team (8 engineers, Taiwan and China) and training junior engineers * Module test and RF performance tuning to fulfill products requirement * Issue module, EVB, and PCB specification / datasheet * Design verification test and come out reports by each phase * Long time business travel to China (~50%), lead R&D and support factory PE test and FA * Project experiences: * Project director of GNSS SiP for iPhone 8, iPhone X and Apple Watch Series 3. * Core member of Wi-Fi/BT SiP module iPhone XS, iPad 6th and MacBook.

* In charge of RF Over the Air (OTA) testing and expatriated in Shanghai, China * Co-work with Apple Inc. engineers to assemble and test mobile products * Lead a team to perform function testing, bug tracking, coexistence, stations maintain, and failure analyzed * Coordinate factory process with PM, SW, Fixture, and PE teams * Develop report tool (Excel VBA) * Business travel to United States to co-work and training with Apple’s engineers * Social recruitment * Project experiences: iPhone 5c, iPad mini, iPhone 6

* In charge of RF hardware circuit design, review PCB layout, elect and validate materials, and create BOM to meet the demand of customers. * Cross department cooperation with Sales, PM, ME, SW, and PCB teams to own the project. * Business travel to factory in China for manufacture; to USA to co-work with customer and on-site support. * Major projects and customers were: a) AP router with ZWave – NTT Docomo, Japan, b) power line communication (PLC) – Watteco, France, c) 802.11a/n AP module – AirTies, Turkey and Telefonica, Spain, and d) telecommunication transceiver module and system, OnRamp, USA