Choduboyina Chittibabu
Assistant Engineer
About
As an Assistant Engineer at TTE Electronics Pvt Ltd, I contribute to mass production readiness and process optimization, ensuring efficient line layouts, operator training, and adherence to SOPs. My role involves addressing production challenges through root cause analysis, implementing corrective actions, and optimizing consumables use and productivity. Currently pursuing an MTech in Electrical and Electronics Engineering at JNTU Gurajada, I aim to further enhance my expertise in operations process improvement and product design. I am motivated to drive efficiency, quality, and sustainability in production workflows, leveraging a strong foundation in industrial engineering principles.
India
Tirupati
Retail
Failure Modes, Methods Engineering, New Item Development, Product Design, Operations Process Improvement, Plasma Preparation, Product Launch, Organization Skills, Production Readiness, Production Analysis, Follow-on Offerings, Agriculture, Yield Enhancement, Interpersonal Skills, CIP systems, Decision-Making, Production Lines, Stability Testing, Process Planning, Mass Production
Experience

Assistant Engineer
TTE Electronics Pvt Ltd
Mass Production - Line Readiness preparation & review Follow up and Collection of NPI documents. Line layout, plan & requirements as per model. MP readiness ensuring all jigs, fixtures availability. LOB analysis, optimize and improve Giving\Providing the better knowledge on operating process to operators. Providing awareness on SOP, also the purpose to follow. Target: Zero process guidance error Line rejection review and handling RCA and CA for the Line production issues and escalation Improvements Implementation for better Utilization of consumables, space, enhancing the productivity, improving the quality, 5S implementation Line process defect rate control improvements to maintain within target PPM Identify the risk assessment during the process. Educate the operators regarding OC defect severity and defect rate. Diving deep knowledge on the defect analysis part.

Junior Engineer
Foxlink India Electric Pvt Ltd
FATP PROCESS (BACK END) ENGINEER:(APPLE CABLE) Planning and setting up new assembly line, end-to-end process validation and implementation for NPI Responsible for new product development and engineering build Cycle time study, Head count reduction Preparation of process flow chat, control plan &SOP Doing Kaizen/Cycle time reduction activities to ramp up the volume Understanding of SPC, Process Validation, Cycle time study, new product design Follow the DFM define the process, Ability to think for process or equipment improvement (KAIZEN) Process Planning, Plan development and process design for assembly line Fixtures and gauges buy off, CCD (charge coupled device) maintenance Preparation of FACA report, performing 5-why analysis and 4M analysis to reduce failures Responding to customer complaints and implementing corrective actions Develop and implement improvements affecting quality of products safety of operators Monitoring line stability to avoid line failures such as cosmetic & functional failure Investigating problems, analyzing root causes and derive resolution Preforming fixture modification, fixture maintenance. Industrial Engineer: Cycle time & Capacity Optimization- track CT, identify bottlenecks& improve Process improvements (HCR, CIP)-Drive cost reduction & lean initiatives 4MC Report management-prepare, fallow up with customers& updates layouts in AutoCAD New Product introduction (NPI)-plan layouts, material flow, HC mapping & ergonomics validation Engineering Support- CT/UPH validation, and line balancing Bottleneck analysis & elimination to ensure one piece flow in production line Develop and implement improvements affecting quality of products safety of operators

GET
NeoLync Telecommunication Pvt Ltd
SMT PROCESS ENGINEER:(SETUP BOX, KEYPAD MOBILE, WIFI ROUTER) Planning and setting up new assembly line, end to end process validation and implementation for NPI Preparation of process flow chat & control plan Performing SPI (solder paste inspection) programming Daily basis verifying all SMT related (Screen printing, SMD, Reflow& AOI) machines process parameters as per PDL Responding to customer complaints and implementing corrective actions Monitoring line stability to avoid line failures such as cosmetic & functional failure Handling the SMT (Screen printing, SMD, Reflow) & Back-end line to reduce the process issues and to improve the Yield Improve the SPI yield, AOI yield, Parameter settings of SPI, reflow, wave soldering Preparation of reflow profile board, wave profile board, Preparation of reflow profile and wave profile Verification of stencil and solder paste Follow the DFM define the process, improve CIP points Investigating PCBA problems, analyzing root causes and derive resolution Performing fixture modification, fixture maintenance.
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