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Project: Embedded IPD Substrate Development for Next-Generation AI/GPU (FCBGA) Key Achievements ： 1. Executed equipment qualification (PCR) for Die-Attach and AOI systems and implemented an AOI Defect Mapping system to boost production inspection efficiency by 80%; established IQC SOPs and successfully delivered the first batch of functional prototypes to packaging houses for electrical and reliability testing. 2. Engineered a high-precision Die-Attach process by transitioning alignment from ¼-panel to single-piece PCS, achieving a 33% improvement in placement accuracy and ensuring zero defects during the initial prototyping phase. 3. Defined DFM guidelines and Process FMEA specifically for embedded IPD structures, identifying and mitigating critical failure modes prior to scale-up to ensure design robust enough for NPI transition. 4. Led cross-functional synchronization (PM, NPI, PE, and MFG) to consolidate process technical specifications, establishing the Cp/Cpk baseline and technical roadmap required for mass production readiness.

Project: Qualification of Resonac GEA-795G (Low-CTE, High-Modulus) Laminate for Next-Gen FCCSP Key Achievements : 1. Personally executed comprehensive material characterization and process optimization; validated fundamental properties (CTE, Modulus, Tg) and established optimal parameters for Lamination, Laser drilling, and Desmear/Plasma treatments to ensure superior interface adhesion and thermal stability. 2. Spearheaded cross-functional collaboration with NPI and engineering teams to deliver prototype lots to OSAT partners; achieved 100% pass rate in initial packaging validation, ensuring the substrate met all technical requirements for NPI transition. Project: Laser Alignment Precision Optimization for Advanced IC Substrates (FCCSP/SiP/PoP/Memory) Key Achievements : 1. Personally executed systematic DOE (Design of Experiments) trials by optimizing laser equipment parameters and substrate design factors, successfully enhancing alignment precision by 33% (from 15µm to 10µm) to meet the stringent registration requirements for high-densityFCCSP, SiP, PoP, and Memory applications.

Project: Process Capability Enhancement & Laser AOI Integration for Tier-1 Mobile FCCSP Key Achievements : 1. Personally executed the PCR certification for Camtek (CIMS) Laser AOI and optimized laser drilling parameters, enhancing via process capability from 60µm to 50µm; established SOP/FMEA protocols and led the technical handover to PE and Manufacturing for production readiness. 2. Orchestrated cross-functional collaboration (PM, NPI, PE, MFG) to deliver prototypes for Tier-1 customer OSAT validation; successfully achieved HVM (Mass Production) release and secured major client orders. Project: CO₂ Laser Capability Breakthrough for Ultra-Fine Via Production (BT 40µm / ABF 30µm) Key Achievements : 1. Personally developed and tested ultra-fine via processes using Mitsubishi CO₂ laser platforms, achieving via sizes of 40µm (BT) and 30µm (ABF); successfully eliminated the need for UV laser investment, significantly reducing CAPEX (Capital Expenditure) for FCCSP, FCBGA, and SiP/PoP applications. 2. Qualified the optimized drilling process through rigorous internal reliability testing, successfully maximizing existing equipment capabilities to meet next-generation high-density substrate requirements.