Camy (Ting-Yu) Chang

GPU system Product Manager

• Lead a team of two FAEs, identifying new business opportunities within existing customer base, ensuring smoothness of projects and timely resolution of urgent events. Fostering client relationships and driving revenue growth. • Facilitate the professional development of team members by providing comprehensive training and mentorship, aligning their skills with company objectives, and advocating for their professional growth and benefits. • Actively participate in conferences within HPC and networking sectors, conducting comprehensive market analysis and competitive intelligence to inform strategic decisions, ensuring alignment with the latest technology trends. • Drive the formulation and execution of business strategies, optimizing factory technology roadmap in alignment with market opportunities. • Successfully identify and establish relationships with prospective clients, strategically engaging with potential companies in their early stages. Collaborate to set the foundation for partnerships and contributing to business network expansion.

• Provide customer support for thermal and metal-related solutions across diverse industries, fostering relationship with major players in high performance computing (HPC), Cloud Service Provider (CSP), Networking & Telecom, Consumer Electronics, VR/AR/wearable device, graphic cards (GPU). • Facilitate seamless communication between clients and China factory, ensuring a smooth product development cycle. Collaborate on DFM feedback, manufacturability assessment and system requirements fulfillment. • Lead multi-functional team internally and communicate with all stakeholders to ensure products are built to meet specification. Advocate for customer’s request and coordinate internal resources to provide timely response. Escalate for attention and resources when necessary. • Demonstrate expertise in project management, driving project schedule, tracking technical issues (MIL), identifying risks, developing mitigation strategies, facilitating solutions, providing accurate executive summaries and ensuring operation readiness and completion of deliverables for all phases of product development cycle. • Thrive in fast-paced environment, able to work independently and pick up technical content quickly to resolve issues during bring-up and life of product. Possess knowledge of factory operation, OEM/ODM/CM business model and supply chain relationship management. • Evaluate prototyping and production cost internally, providing cost breakdown and devising effective quote strategies and leading negotiations with customers to achieve favorable outcomes.

• Novel photolithography patterning of OLED, including spin coating, alignment, development, reactive ion etching (RIE), pattern design, metal lift-off and surface profiling • Resolved the anisotropic and non-uniformity issues of plasma etching and pixel structure • Achieved integrated three colors in a single matrix with photolithography • Scaled down of patterning to 20um subpixel (640 ppi) and resolved issues arising from miniaturization • Retaining the vitality of the organic thin film throughout the patterning process with troubleshooting and failure analysis

• Carried out silicon wafer processing with photolithography including adhesion promotion, ashing, and wet etching • Experience with CMOS fabrication including diffusion, oxidation, PVD, CVD, IMP, CMP, plasma etching • Characterized the electrical properties such as capacitance, resistance, I-V curves with source measurement unit(SMU)

• Thin film fabrication, including spin coating and vacuum evaporation; and measurement of efficiencies of OLED • Conducted experiments on new crosslinkable materials suitable for hole injection/transporting layer in order to solve the problem of solubility of hole transporting layer and emission layer in OLED • Systematically optimized the device based on the structures and physical properties of materials such as bandgap, electron and hole mobility