Basant Saini
Senior Engineer R&D @ Kaynes Semicon Private Limited
About
Semiconductor R&D and Advanced Packaging professional with 8+ years of experience spanning device modeling, fabrication, testing, and OSAT-based package development. Over the last 2 years, deeply involved in NPI/NPD, package feasibility, and manufacturing readiness in an OSAT environment, delivering QFN, QFP, CSP, FCBGA, SiP, wafer-level and 2.5D/3D packaging solutions. Prior experience at IIT Bombay includes device modeling, cleanroom fabrication, wafer-level characterization, and materials analysis, providing a strong silicon-to-system foundation. I bring a unique ability to connect device physics, package design, and manufacturing constraints using SI/PI, thermal and multi-physics analysis to enable first-time-right, scalable semiconductor products.
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Basant Saini's Contact Information
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