Atlund Smith

• Designed NAND component package databases o Routed the PCB substrate for NAND based on ONFI standards o Determined Si die placement and specified wirebond to the substrate • Developed test packages for trace crack and solder joint reliability testing • Performed solder joint reliability FEA simulations using ANSYS APDL and optimized component placement based on SJR results • Worked with manufacturing and assembly companies to review designs and optimize for manufacturing • Used Windchill to manage product life cycle of documents and parts

• Mechanical design of validation tooling enabling processor debug testing o Project requirements involved thermal, structural, and fluids analysis o Designs included a wide range of test hardware including sockets, retention mechanisms, thermal solutions, optical probe lids, and die prep hardware. • Designed collaterals for robotic handlers and thermal heads • Created technical drawings for mechanical assemblies and parts • Worked with vendors for quotes and fabrication • Performed FAI and validated prototype designs before volume deployment • Used Pro-e extensively for modeling and FEA • Pioneered development of integrated-cooling-socket thermal control method • Provided dedicated mechanical and thermal tool support for test labs • Managed projects including collecting stakeholder requirements, defining the project scope, determining the project schedule, and delivering tooling to meet key program milestones • Worked in collaboration with external customers to design custom testing solutions for their system environment • Worked to enable outsource vendor with thermal controller and configure their facility for onsite testing to detect hardware defects sooner

• Mechanical design of tooling enabling processor debug testing • Project requirements involved thermal, structural, and fluids analysis • Designed collaterals for robotic handlers and thermal heads • Drafting and coordination with vendors for quotes and fabrication • Used Pro-e extensively for modeling and FEA • Pioneered development of integrated-cooling-socket thermal control method • QA and inspected tooling from vendors • Visited labs to troubleshoot tooling issues

Provided math and science tutoring to high school student. Included; AP Calculus, Trigonometry, Algebra, Geometry, AP Statistics, Physics, Chemistry.

Assessed incoming repairs. Specified replacement components. Performed repairs. Assembled new bikes. Laced wheels. Overhauled hubs and bottom brackets. Comprehensive bike tuneups.

Assessed incoming repairs. Specified replacement components. Performed repairs. Assembled new bikes. Laced wheels. Overhauled hubs and bottom brackets. Comprehensive bike tuneups.