Ashish Gupta, Ph.D.

Head of Custom Silicon Packaging @ Amazon Web Services (AWS)

About

Seasoned engineering and business leader with 20+ years driving E2E development of advanced packaging, leading-edge AI data centers and disruptive computing solutions across multiple business units. 15+ of experience building and empowering global cross-functional inclusive engineering teams and leaders for long-term growth. Proven track record of cultivating strong relationships with vendors, suppliers, and customers. I am passionate about: (1) Leading with integrity to deliver long-term value creation for customers and society. (2) Taking innovative technologies from ideation to deployment. (3) Simultaneously addressing complex technology, cost, schedule and business challenges. (4) Developing vision, strategy and aligning organizational culture. (5) Building strong teams and crafting the organization to be much stronger than what I found. 9 patents granted | 70+ technical papers | Purdue University Outstanding Alumni Award | International Keynote / Panel Speaker | University Board of Advisors

Country

City

United States

Industry

Semiconductors

Skill

AI Data Centers, Advanced Packaging, Data Center Infrastructure, Customer Engagement, Innovation Management, Global Cross-Functional Team Leadership, Packaging, Assembly and Test, Data Centers, Product Lifecycle Management, People Management, Management, Project Management, Product Management, Product Development, Lean Manufacturing, Product Design, Mechanical Engineering, Engineering Management, Heat Transfer, Cross-functional Team Leadership

Experience

Head of Custom Silicon Packaging

Amazon Web Services (AWS)

2026-3 - Present · 7 mos

Austin, TX

Amazon's custom chip business - Trainium, Graviton and Nitro product lines. https://aws.amazon.com/silicon-innovation/

Senior Director, GPU Customer Program Management

AMD

2025-1 - 2026-3 · 1 yr 3 mos

Austin, TX

Delivered AI customers (Hyperscalers, CSPs, Enterprise, HPCs, OxMs) success across our entire Instinct GPU portfolio by ensuring successful deployments and rapid issue resolution.

Senior Director, Hardware Engineering, Data Center and Artificial Intelligence Group

Intel

2020 - 2024-12 · 5 yrs

Portland, OR

Delivered component-to-rack hardware engineering to support $10B+ annual revenue of Intel’s DCAI product portfolio. Supervised a team of ~150 ppl across US, Mexico, China, Taiwan and India. Headed Intel's Liquid Cooling engineering and business strategies for Cloud to Edge deployments.

Director, Hardware Engineering, Client Computing Group

Intel

2016 - 2020 · 4 yrs

Portland, OR

Led all component-to-system hardware and power-management to support $30B+ annual revenue of Intel’s Client portfolio (Laptops, Ultrabooks, Gaming, VR/MR, Desktop). Supervised a team of ~180 ppl across US, Latin America and Asia.

Director, Advanced Packaging Assembly and Test Technology Development

Intel

2010 - 2016 · 6 yrs

Chandler, Arizona, United States

Responsible for all component thermal and process engineering to support Advanced Packaging, Assembly and Test technologies for Intel’s product portfolios (Servers, HPC, Client, Foundry, Tablets, IoT and Embedded) from early definition to HVM ramp.

Sr. Packaging and Test R&D Engineer

Intel

2004 - 2010 · 6 yrs

Chandler, AZ

Delivered packaging and test research and technology development for 65nm-32nm Client and Server products.

Executive Committee

IEEE ITherm

2012 - 2024 · 12 yrs

https://www.ieee-itherm.net/itherm-2025-executive-committee/ • Executive Committee Member (2024 - Present) • General Chair (2024); Program Chair (2023) • Track Chair (2014-2022)

Member of the Board of Advisors

Washington State University

2018 - 2021 · 3 yrs

Bring industry perspective, provide input to the continuous evaluation of objectives and assessment of outcomes of the curricula, and suggest changes for implementation, as needed.