Andy Elms

Responsible for Manufacturing Operations at Haslingden and Delph

Responsibilities and achievements: ■ Operational lead for Production, Manuf. Engineering, Facilities, Stores, QHSE & Test Engineering for Printed Circuit Board Assembly (PCBA) and Final System Assembly ■ Member of the Board of Directors ■ Achieved a consistent YoY revenue growth rate of 28%, elevating turnover from £19M to £40M ■ Revamped, provided guidance, and nurtured self-sufficiency in the Manufacturing Leadership Team. This involved establishing transparent expectations, redefining job descriptions, and investing significant time in coaching and mentoring on the shop floor. ■ Introduced Key Performance Indicators (KPIs) throughout the organization and established annual departmental goals aimed at enhancing KPI performance ■ Developed and implemented an informative annual appraisal process for all employees, which has contributed to aligning the company’s direction ■ Initiated Final System Assembly Out of Box Audits (OOBA) at an Approved Quality Level (AQL) and subsequently designed and implemented In Process Quality Control Audits (IPQC) throughout the manufacturing operations. Resulting in an impressive Delivered Quality performance exceeding 99.8% ■ Designed and implemented a Lean Manufacturing initiative within the facility in collaboration with an external Lean Consultant. Initially focusing on identifying and eliminating sources of waste, leading to several impactful project completions ■ Introduced daily Production Meetings with a 'stand-up' and 'scripted' format. Provides a daily snapshot of performance relative to internal targets and On Time Delivery (OTD) and the strategies for addressing any shortcomings ■ Introduced Production Targets and Visual Management (VM) Production Control Boards, displaying hourly performance (throughput & yield) at all Final System Assembly stages, increasing team and cell output performance from 50%-100% ■ Implemented 5S controls and audit

Responsibilities and achievements: ■ Operational lead for the Manufacturing Assembly & Aftermarket Technical Repair operations ■ Implementation of manufacturing Best Practices using Lean Manufacturing methods and tools ■ Clients technical interface for Manufacturing & Aftermarket Reverse Logistics (RL) solutions ■ Own New Product / Client Introductions (NPI), define process flows, operational layouts ...etc ■ Set up measurable KPIs for ensuring clear directives to meet SLA customer commitments ■ Created the recruitment strategy to support operational growth, direct and in-direct labour ■ Set the foundations for the business development drive by upgrading the operations to best-in-class condition, positively acknowledged by cooperate management and our technology customers ■ Implemented lean operational reporting methods, product tracking and Key Performance Indicators (KPIs), increased internal efficiencies and customer satisfaction by reducing unit turn around time ■ Relocated 14 contract logistics customer operations into a new 40K SQM ‘built to suit’ facility. As the Prince II Project Executive, I oversaw all aspects of the pre-planning, testing and execution phases, including customer communications. The project was delivered on time with zero internal and/or external customer escalations ■ Introduced 5S into the manufacturing & aftermarket service operations, then rolled out into the warehouse ■ Coached and develop the Country Operations management team to become self-sufficient ■ Developed 'sales pack' marketing material and built up a New Business Development Pipeline

Responsibilities & achievements: ■ Develop new aftermarket business opportunities focusing on product repair & kitting ■ Manage new business awards from FRI / FRQ to Implementation, with a handover to operations ■ Expand the 3rd party repair network to provide our customers with an ‘in-country’ service option ■ Lead the channel ‘white box’ forward logistics project to new account set-up ■ Built a strong team of Project Managers and Product Engineers to lead new business implementations ■ Introduced project management structure (Prince II), improving internal and external communications, senior sponsor 'stage boundary' project phase awareness, project on-time delivery and future project improvements from internal and external 'lessons learnt' sessions ■ Successfully introduced Tablet ful system assembly and test operations into Foxconn Czech Republic ■ Introduced quarterly On Target Earning (OTE) goal sheet performance evaluations for direct reports

Responsibilities & achievements: ■ Operations Manager for two aftermarket service organizations, accountable for two P&Ls - HP 'PC' Repair & Refurbishment operation, supporting Dead On Arrival (DOA) returns - Printed Circuit Board Assembly (PCBA) Repair Center for Sony, HP, Packard Bell, Innolux...etc ■ Responsible for the growth of over 200 employees; Production & Engineering Managers, Shift Supervisors, Rework, Assembly, Test and Quality Inspection Operators, Diagnostics Technicians, Process, Test and Quality Engineers, Parts Procurement and Customers Service teams ■ Creation of Annual Business Plans and Budget, chairperson for Monthly Operations Review (MOR) ■ Developed a Central European PCBA (level 4) repair process solution for Motorola Smartphones ■ Built up Sony EU Netbook & Notebook ‘end user’ repair services with an in-house TAT of <24hrs ■ Added new test equipment & processes to build up Server PCBA repair capability, HP Servers won ■ Introduced a new ad-hoc revenue stream that continues to provide regular and healthy profits

Headhunted by Foxconn to lead the site engineering, process and quality teams to set-up and qualify Printed Circuit Board Assembly (PCBA) manufacturing capability for HP products. Responsibilities & achievements: ■ Responsible for the sites engineering and quality teams, capital equipment, the manufacturing process, in circuit and functional test platforms, internal product quality and delivered quality ■ Drive and own all activities linked to qualifying the factory to build HP desktop and workstation PCBAs by successfully passing the HP factory process audit, including product qualifications and pilot builds ■ Use Lean Manufacturing tools to drive process, quality and efficiency continuous improvement ■ Passed the HP manufacturing process audit, qualification and pilot builds and forced rework exercises, received HPs approval to manufacture PCBAs for workstations, desktops and servers ■ Introduced new best-in-class technologies; automated x-ray inspection (5DX), Automated Optical Inspection (AOI), 1st pass yield In Circuit Test (ICT) automation, Board Grid Array (BGA) semi automated repair process ■ Implemented 5S, then rolled this out into the whole unit final assembly divisions of Foxconn Czech Republic

Responsibilities & achievements: ■ Build a quality organization to support and sustain 6 double sided PCBA production lines, 24/7 ■ Provide dedicated quality engineering support to the New Product Introduction (NPI) team ■ Built up a team of engineers and technicians to support production of Dell and IBM products, supporting both sustaining accounts and new product introductions ■ Improved Internal product yields, 1st pass test results, delivered quality and efficiencies ■ Set-up a component supplier engineering team and introduced a Quality Improvement Plan (QIP) that was aligned with the customers expectations of driving continuous improvement. Progress was reported at Quarterly Business Reviews (QBRs) with our customers ■ Supported a new facility start up in Shanghai, completed pre-qualification audits and drove all open actions to closure. Dell passed off the new PCBA manufacturing facility on the 1st audit attempt.

Overseas assignment to support a new site start up and product transfers from the UK to CZ. Transferring Printed Circuit Board Assembly (PCBA) of Desktops and Servers for Dell Computers.