Amir Jasni

Work closely with Product and Design Engineering teams to define comprehensive test strategies and implement, optimize, and qualify test setups, processes, fixtures, equipment, and software at Contract Manufacturers (CMs). Provide continuous Design-For-Testability (DFT) feedback throughout the product development cycle to ensure robust and manufacturable designs. Lead investigations and troubleshooting of yield and quality issues across SMT, Board Test, HLA, and FSI stages by performing in-depth data analysis, Pareto studies, and yield reporting to drive rapid issue resolution and applying advanced quality methodologies (SPC, Cpk, DOE, GR&R, 5-Why, 8D, USER diagrams) and statistical tools (t/F tests, box plots) to drive continuous yield improvement during prototype and production builds . Collaborate cross-functionally with suppliers, board test, manufacturing, and engineering teams to achieve targeted performance and quality goals. Deploy, qualify, and conduct training for manufacturing test stations at CMs, while developing test procedures, preventive maintenance plans, and troubleshooting guides to support sustained operations. Drive the introduction of new manufacturing test technologies and methodologies to enhance production efficiency and scalability. Provide NPI and high-volume manufacturing support for Magnum Testers, support global teams on new product transfers, part qualification, and software validation, and perform product performance and reliability analysis to continuously improve product design and manufacturing robustness.

Work closely with AOI, AXI, Takaya, ICT, Functional BIB and System Integration teams to support end-to-end PCBA and system test operations. Serve as Test Lead for the Micron SEG workcell, responsible for test manpower and capacity planning, as well as driving yield improvement initiatives for BIB and Monggoose products, including Pin Cards and PS Boards. Act as a technical advisor for tester- and board-related issues, providing expert troubleshooting and root-cause analysis. Lead training and mentoring of new engineers and technicians on product knowledge, tester operation and PCBA debugging and debugging tools such as osciloscope, short locater dll. Manage Engineering Change Notice (ECN) implementation and verification, support new software releases and New Product Introduction (NPI) and execute product transfer activities. Apply Lean methodologies, including A3 and DMAIC projects to achieve cost reduction and continuous improvement. Provide ongoing support for End-of-Life (EOL) evaluations and Return Material Authorization (RMA) investigations to ensure product quality and customer satisfaction.

Served as Technical Lead for the 3 GHz, Lake Tahoe, and Slugger product families, specializing in down-converter products. Led electrical and electronic functional troubleshooting and conducted in-depth evaluations of new failures to accurately narrow down root causes at both system and CCA up to the component levels. Able to use network analyzer, oscilloscope, Frequency counter, spectrum analyzer, DMM, LCR dll. Drove continuous improvement initiatives with cross-functional team members, supported New Product Introduction (NPI) units, and prepared detailed technical data for R&D analysis. Performed process time studies to identify critical bottlenecks, minimized high-volume failure modes at debug WIP, and developed standardized debug guidelines to improve technician productivity and cycle time. Managed subordinates to meet shipment schedules, closely monitored BWIP quantity, aging, and LTR, and led quarterly BWIP reduction plans. Collaborated closely with SDE, PE, and R&D teams for technical escalation and resolution, while verifying test station stability and calibration to ensure reliable debug operations.

Served as a Test Engineer for the Power Oasis (Green Energy Sector) and LTXC Tester projects, holding Bronze Certification and responsible for end-to-end test operations from PCBA component level through HLA assembly and full system integration. Led the development of test procedures and specifications, maintained and controlled test documentation in DOCCON, and managed all test inventories, preventive maintenance, and calibration activities. Performed electrical and electronic functional troubleshooting, verified Engineering Change Notices (ECN), and took ownership of test yield performance and scrap control for boards and components. Acted as audit owner for internal and external (TÜV) audits, supported customer New Product Introduction (NPI) activities, and handled field return investigations with detailed debug reporting. Drove Lean and Kaizen initiatives, including line re-layout, process time studies, and failure Pareto analysis to improve quality, yield, capacity, and operational efficiency. Designed and modified FVT testers and fixtures, developed standardized debug guidelines to enhance technician productivity, and led root-cause investigations for new and recurring failure modes. For the LTXC workcell, managed debug and aging WIP, supported RF tester troubleshooting, applied 80/20 analysis for high fallout models, coordinated closely with customers on NPI evaluation, improved test time and capacity, and ensured on-time shipment through effective WIP planning, prioritization, and cross-functional communication.

Served as an Assistant Engineer (Test and Debug) in the semiconductor industry, supporting Project Credence (Tester), Draeger (Medical), and Dragonwave (RF) products by ensuring optimal operation, setup, calibration, validation, and preventive maintenance of test equipment in production. Provided electrical and electronic functional troubleshooting support, efficiently managed debug inventory, and ensured production teams maximized utilization of test resources. Took ownership of test yield performance and scrap control for boards and components, supported test acceptance and qualification activities, and contributed to continuous improvement initiatives. Supported the rollout of new testing methods and implementation of test strategies and inspection productivity solutions, while resolving daily line issues. Led efforts to minimize high-volume failure modes at debug WIP through structured root-cause investigations, evaluation trials to improve quality, yield, and performance, and the development of standardized debug guidelines to enhance technician efficiency and turnaround time.

Served as a Test and Process Technician in the semiconductor industry with hands-on exposure to RF and microwave technology supporting Agilent products. Performed RF microwave testing and tuning using equipment such as sweep oscillators, scalar network analyzers, RF plug-ins, power sensors, and calibration kits. Actively supported pilot builds through buy-off and test station setup, while ensuring smooth production operations to meet shipment targets. Monitored, investigated, and mitigated technical issues on the production line, conducted evaluations to improve yields and reduce production costs, and collaborated closely with fellow technicians and test engineers in troubleshooting customer line return failures. Applied statistical process control by plotting Z-charts, monitoring critical process parameters (UCL/LCL), and performing GR&R studies for key test stations. Managed equipment and calibration due dates, handled delicate RF connectors with high precision, and provided training and technical support to test and assembly operators to ensure consistent product quality and process compliance.