Adrian Shih

 Manage PCB supplier relationships, manage supplier cost structure (cost, split, MOQ, CT2R), and secure AOS (assurance of supply).  Conduct eRFQ for periodic cost-saving initiatives and deliver business instructions/strategies.  Develop PCB sourcing strategy based on market status, Cisco direction, and supplier business commitment.  Develop cost tools for PCB NPI and sustaining negotiation utilization.

 Manage Power/PCB business definition following HPE project schedules  Manage Power/PCB supplier relationship, manage supplier sharing and secure AOS (assurance of supply)  Develop Power/PCB sourcing strategy based on the supplier roadmap, project schedule, specification, and FCST demand  Manage spending/periodic cost saving for PSU, power cord, battery, UPS/PDU, and PCB.  Drive new product launch by co-working with RD team and Power/PCB suppliers and provide support from supply chain perspective  Execute PSU interlock as a program manager and a supplier owner, focusing on obsolescence projects, share (allocation) management, demand analysis, and product supply status  Drives supply base optimization for complex categories. AVL definition.

 Manage supplier relationship to achieve cost targets, to attain quality requirements, and to ensure continuity of supply for Lenovo server business  Conduct RFI/RFQ and cost saving initiatives, and deliver business instruction/strategy  Develop PCB sourcing strategy based on the project schedule, specification, and demand quantity  Chase and secure PCB PO schedule to ensure Business / Supply Continuity for IBM/Lenovo  Execute periodic cost saving for PCB raw cards by using cost analysis tool (cleansheet)  Key Achievement: cost saving 12% per year, 30% per life cycle

 Manage memory engineering process (DIMM implementation) following IBM/Lenovo project schedules  IBM/Lenovo PN maintenance, including supplier sourcing and qualification and new technology review  Coordinate with system development team and QA team to execute memory qualification and debug FA case.  Manages global engineering relationship with memory suppliers. (Samsung, Hynix, Micron, Kingston)  Manage BOM and provide solutions for IBM CE and ODMs to lock down the part selections  Project (Qualified Parts Exchange) execution. Secure supply chain quality, support, and cost on Electrical parts  Project (Qualified Parts Exchange) key achievement: cost saving 33% per project

 Analysis Qualification failed and field returned DIMMs DIMM by using various problem solving techniques, including SMT, cardtest, advantest, 2D/3D X-ray, OM inpection  Define the root cause and report to customers with effective corrective actions

Electrical Engineering, Solid State manufacturing

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