Yong Zhang

wafer handling and clamping

Feasibility study on next generation water positioning systems, involving dynamics, precision design, and electro magnetic actuation.

Within Research & Technology program, I am responsible for developing various feasible hardware solutions for wafer positioning, clamping, and handling modules in lithography systems.

Focused on the development of compliant multi-stable mechanisms for positioning/actuation, energy absorption, and vibration isolation, involving design, simulation, and experimental validation. During this period, I have: • Proposed design methods for rotational stiffness and developed non‑linear finite element models for static/dynamic analysis; evaluated structural/thermal deformations and vibration isolation performance. • Built an experimentally verified theoretical framework to analyze kinematics and stability. • Constructed 3D models and made prototypes with 3D printing and laser-cutting. • Validated the kinematics, strength, modal response experimentally with the uniaxial loading and vibration testing. • Designed and built a dynamic test setup for measuring energy harvesting response based on the snap‑through vibration. • Proposed and validated monolithic zero-stiffness mechanism designs for vibration isolation.

- Department: Precision and Microsystem Engineering - Specialization: flexural mechanism/structures, finite element modeling, structure dynamics, and additive manufacturing

Focused on the design and computational modeling of lightweight lattice structures. • Involved in the entire process of design, analysis, and fabrication of corrugated sandwich structures from scratch. • Developed an analytical framework to predict stiffness and buckling of lightweight structures and verified results with implicit/explicit finite element modeling. • Tested and validated structural static and dynamic responses experimentally, e.g, cyclic and impact loading. • Developed Molecular Dynamics Simulation Models for multi-scale analysis of nano-materials.