
SPTS Technologies Ltd, a KLA Company
About
SPTS Technologies became KLA Corporation UK Ltd in May 2025. The company designs, manufactures, sells, and supports advanced etch, and deposition equipment and process technologies for the global semiconductor and microdevice industries, with focus on the MEMS, advanced packaging, high speed RF device, power management and photonics sectors. The solutions offered include industry leading silicon etch, dielectric etch, dry-release etch, PVD, MVD® and PECVD, all available with a range of wafer-handling options applicable to R&D, pilot production, or volume production environments. Statements made on LinkedIn may constitute forward-looking statements under federal securities laws. These forward-looking statements involve risks and uncertainties that could significantly affect the expected results and are based on certain key assumptions. Due to such uncertainties and risks, no assurances can be given that such expectations will prove to have been correct, and readers are cautioned not to place undue reliance on such forward-looking statements, which speak only as of the date indicated. Other risks that KLA and its subsidiaries face include those detailed in KLA filings with the Securities and Exchange Commission, including KLA's annual report on Form 10-K and quarterly reports on Form 10-Q. Forward-looking and other statements made by third parties do not necessarily reflect the opinion of KLA or its subsidiaries, are outside of KLA’s control and have not been verified or otherwise vetted by KLA or any of its subsidiaries.
GB
Ringland Way, Newport
NP18 2TA
Public Company
385
Semiconductor Manufacturing
wafer processing solutions; PVD; PECVD; DRIE; silicon etch; dielectric etch; dry-release etch; FOWLP; through-silicon vias (TSVs); MEMS; Advanced Packaging; wafer level packaging (WLP); HF release etch; XeF2 vapor release etch; Plasma Dicing; MVD; FOWLP; Compound Semiconductors; PiezoMEMS; Silicon Carbide (SiC); VCSELs; Via Reveal
Top Decision Makers · 2
Deposition Engineering Technologist
Dean Stephens
United Kingdom
******@***.com
Phone
(**) *** ****
Application Engineer
Jarvis Hung
Taiwan
******@***.com
Phone
(**) *** ****
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