Cressem
About
Cressem is creative assembly solution provider for the Electronics manufacturing industry. Cressem provides Ultrasonic ACF bonding solution of the FOF(Flex On Flex), FOB and FOG assembly. It is the most advanced assembly technology for Display, TSP, Smart card, Wearable & Flexible device, mobile device and smart glass manufacturing business.
KR
103-901 SK Ventium Bldg., Gunpo, Kyunggi-do
435-776
Public Company
19
Machinery Manufacturing
Ultrasonic ACF bonder; OCA, OCR; Underfill material; Packing material
Top Decision Makers · 1
Software Engineer
인산 강
South Korea
******@***.com
Phone
(**) *** ****
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